Thin film-based sensor array
TW202636086APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114138072
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-20
- Filing Date
- 2025-10-02
- Publication Date
- 2026-09-01
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Abstract
A method and a device are provided to measure temperatures of a semiconductor wafer in a semiconductor chamber. The device is formed by depositing a thin film matrix stack of aluminum thermoelements and zinc oxide thermoelements on a semiconductor wafer, wherein the aluminum thermoelements and the zinc oxide thermoelements form a junction at each intersection of the thin film matrix and each junction generates a thin film thermocouple. A multiplexor and a microprocessor are affixed to the thin film matrix stack to receive a thermoemf signal from each thin film thermocouple. The generated signals from the thin film thermocouples may be communicated wirelessly. The generated signals from the thin film thermocouples may be processed and compared to determine a number of signals that should be communicated from a local group based on available bandwidth.
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