Semiconductor manufacturing system and deformation detection method
TW202636092APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW115103455
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-07
- Filing Date
- 2026-01-29
- Publication Date
- 2026-09-01
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Abstract
The semiconductor manufacturing system of the present invention includes: a transport device for transporting at least one of a substrate and a consumable part as the transported object; and an end effector disposed at the end of the transport device to support the transported object. Furthermore, the semiconductor manufacturing system includes: a deformation detection unit for detecting information regarding the deformation of the end effector; and an information processing unit for acquiring the detection information from the deformation detection unit and understanding the deformation state of the end effector based on the detection information. Thus, the semiconductor manufacturing system can effectively understand the deformation of the end effector supporting the transported object in the transport device.
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