Substrate inspection method and substrate inspection system

Abstract

A substrate inspection method and system according to an embodiment of the present invention include: for a glass substrate having a plurality of holes formed for forming electrodes, the steps of inputting a first input image taken above the substrate and a second input image taken below the substrate; generating a first depth map including depth information of the first input image and a second depth map including depth information of the second input image based on the first input image and the second input image; combining a portion of the first depth map and a portion of the second depth map to generate a combined depth map; and calculating a depth line including hole shape information using the combined depth map, and analyzing the three-dimensional shape and defects of the holes based on the depth line.

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