Probe structure and inspection apparatus
TW202636126APending Publication Date: 2026-09-01NIHON MICRONICS KK
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Patent Information
- Application Number
- TW114139749
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-05
- Filing Date
- 2025-10-15
- Publication Date
- 2026-09-01
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Figure TWG2TA001074380_001 
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Abstract
In order to achieve impedance matching of the connection terminals serving as relay points in signal circuits, the present invention provides and receives high-frequency signals between itself and the tested object via a contact portion that makes electrical contact with the electrodes of the tested object. The probe structure includes: a body, a substrate holding member, a connector, and an impedance adjustment section. The substrate holding member has a wiring substrate on one surface and is fixed to the body; the connector engages with the wiring substrate of the substrate holding member and connects the wiring of the wiring substrate to a coaxial cable via a connection terminal; the impedance adjustment section adjusts the gap between itself and the connection terminal to achieve impedance matching.
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