Test methods, probe tips, probe cards, and probe systems for microbump testing

Abstract

This invention provides a test method, probe head, probe card, and probe system for microbump testing. The test method includes providing a device under test (DUT) with a first bump unit configured to transmit power or ground signals and a second bump unit to transmit test signals. The first bump unit has a plurality of clustered microbumps. The DUT is placed on a support platform of the probe system. A probe card is provided, wherein the distance between the tips of adjacent probes is greater than or equal to the width of a microbump. The probes of the probe card contact the bump units of the DUT to test the DUT. This invention reduces the manufacturing difficulty, cost, and difficulty of on-machine testing of probe cards, avoids overly complex design of the DUT, and avoids the problem of short circuits or interference caused by collisions between adjacent probes.

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