Thermal prediction and regulation during integrated circuit testing
TW202636135APending Publication Date: 2026-09-01ADVANTEST CORP
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Patent Information
- Application Number
- TW114151790
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-25
- Filing Date
- 2025-12-29
- Publication Date
- 2026-09-01
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Abstract
One embodiment of the present invention sets forth a technique for performing integrated circuit testing. The technique includes generating one or more temperature predictions for an area of interest within an integrated circuit based on sensor data associated with the integrated circuit. The technique also includes determining, based on the one or more temperature predictions and one or more control properties associated with the integrated circuit, one or more control parameters associated with a test of the integrated circuit. The technique further includes causing the test of the integrated circuit to be performed based on the one or more control parameters.
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