Thermal prediction and regulation during integrated circuit testing

TW202636135APending Publication Date: 2026-09-01ADVANTEST CORP
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Patent Information

Application Number
TW114151790
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-09-25
Filing Date
2025-12-29
Publication Date
2026-09-01

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Abstract

One embodiment of the present invention sets forth a technique for performing integrated circuit testing. The technique includes generating one or more temperature predictions for an area of interest within an integrated circuit based on sensor data associated with the integrated circuit. The technique also includes determining, based on the one or more temperature predictions and one or more control properties associated with the integrated circuit, one or more control parameters associated with a test of the integrated circuit. The technique further includes causing the test of the integrated circuit to be performed based on the one or more control parameters.
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