Optical package structure and manufacturing method thereof

Abstract

The present invention provides an optical package structure and manufacturing method thereof, which firstly arrange an electronic element in a groove of a circuit board, then stack a semiconductor element on the electronic element, and then a connect optical element to the semiconductor element, wherein the electronic element is formed with a plurality of conductive vias, so that the semiconductor element and the optical element can be electrically connected to the circuit board through the plurality of conductive vias, thereby shortening the path of electrical transmission.

Claims

1. An optical packaging structure, comprising: The circuit board has a first side and a second side opposite to each other, and a groove is formed on the first side; An electronic component has opposing first and second surfaces and has a plurality of first conductive vias penetrating the first and second surfaces, such that the electronic component is accommodated in the groove on the second surface and is electrically connected to the circuit board. A semiconductor element has a third surface and a fourth surface opposite to each other, such that the semiconductor element is disposed on the electronic element with the fourth surface and is electrically connected to the electronic element; And an optical element, disposed on the semiconductor element and electrically connected to the semiconductor element.

2. The optical packaging structure as described in claim 1, wherein, This electronic component is a conversion-type application-specific integrated circuit.

3. The optical packaging structure as described in claim 1, wherein, This semiconductor device is an integrated circuit element.

4. The optical packaging structure as described in claim 1, wherein, The semiconductor device has a plurality of second conductive vias that penetrate the third surface and the fourth surface.

5. The optical packaging structure as described in claim 1, wherein, The semiconductor device is disposed on the circuit board and the electronic component with the fourth surface, and is electrically connected to the circuit board and the electronic component.

6. The optical packaging structure as described in claim 1, wherein, The optical element is either an optical chip or an optical module.

7. The optical packaging structure as described in claim 6, wherein, The optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.

8. The optical packaging structure as described in claim 1, wherein, The optical element is equipped with optical accessories, which are supported by the circuit board.

9. The optical packaging structure as described in claim 1, wherein, A filler layer is formed between the optical element and the circuit board so that the filler layer covers the semiconductor element and the electronic element.

10. The optical packaging structure as described in claim 1, wherein, The second side of the circuit board is provided with a plurality of conductive elements.

11. The optical packaging structure as described in claim 1, wherein, The circuit board, together with the electronic component, the semiconductor component, and the optical component located in the recess of the circuit board, forms a three-layer vertical stacked structure.

12. A method for manufacturing an optical packaging structure, comprising: A circuit board is provided having a first side and a second side opposite to each other, and a groove is formed on the first side; An electronic component is disposed in a recess in the circuit board, wherein the electronic component has opposing first and second surfaces and a plurality of first conductive vias are formed through the first and second surfaces, so that the electronic component is accommodated in the recess with the second surface and electrically connected to the circuit board; a semiconductor element is disposed on the electronic component, wherein the semiconductor element has opposing third and fourth surfaces, so that the semiconductor element is disposed on the electronic component with the fourth surface and electrically connected to the electronic component; and an optical element is disposed on the semiconductor element and electrically connected to the semiconductor element.

13. A method for manufacturing the optical packaging structure as described in claim 12, wherein, This electronic component is a conversion-type application-specific integrated circuit.

14. A method for manufacturing the optical packaging structure as described in claim 12, wherein, This semiconductor device is an integrated circuit element.

15. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The semiconductor device has a plurality of second conductive vias that penetrate the third surface and the fourth surface.

16. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The semiconductor device is disposed on the circuit board and the electronic component with the fourth surface, and is electrically connected to the circuit board and the electronic component.

17. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The optical element is either an optical chip or an optical module.

18. A method for manufacturing the optical packaging structure as described in claim 17, wherein, The optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.

19. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The optical element is equipped with optical accessories, which are supported by the circuit board.

20. A method for manufacturing the optical packaging structure as described in claim 12, wherein, A filler layer is formed between the optical element and the circuit board so that the filler layer covers the semiconductor element and the electronic element.

21. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The second side of the circuit board is provided with a plurality of conductive elements.

22. A method for manufacturing the optical packaging structure as described in claim 12, wherein, The circuit board, together with the electronic component, the semiconductor component, and the optical component located in the recess of the circuit board, forms a three-layer vertical stacked structure.

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