Electronic package

Abstract

The present invention provides an electronic package, which includes a substrate, an electronic component stacked on the substrate, and an optoelectronic module stacked on the electronic component, wherein the electronic component is formed with a plurality of conductive through holes so that the optoelectronic module can electrically connect the electronic component and the substrate by a plurality of the conductive through holes, thereby shortening the electrical transmission path.

Description

[Technical Field]

[0001] This invention relates to a semiconductor structure, and more particularly to an electronic package with an optoelectronic module. [Previous Technology]

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multi-functionality and high performance. The application of current fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, computed, and stored. In particular, the demand for data transmission is surging, leading the industry to replace electricity with light as the data transmission carrier to improve transmission capacity, efficiency, and distance, while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please refer to Figures 1A and 1B, which are cross-sectional and partial top views of a conventional co-packaged optical device 1. It mainly has an optoelectronic module 11 disposed on a circuit board 10. The optoelectronic module 11 includes a semiconductor chip 112 formed in the package structure 111 and an optical chip 113 disposed on the package structure 111, so that the optical signal is transmitted to the optoelectronic module 11 for communication. At the same time, a switching chip (switch IC) 12 needs to be disposed on the circuit board 10 in order to be used in the terminal product. The switching chip 12 is first disposed on a substrate 13 and then disposed on the circuit board 10 through the substrate 13.

[0004] However, the optical chip 113 and the conversion chip 12 in the aforementioned co-packaged optical device 1 need to be connected by electrical circuits in the circuit board 10 and the substrate 13. However, the path is too long, which causes the signal transmission to be too slow and lossy, resulting in problems in the application of end products.

[0005] Therefore, how to overcome the problems of the aforementioned conventional technology has become an urgent issue to be addressed. [Summary of the Invention]

[0006] In view of the various deficiencies of the prior art, the present invention provides an electronic package comprising: a substrate having a first side and a second side opposite to each other; an electronic component having a first surface and a second surface opposite to each other, and having the second surface disposed on the first side of the substrate, and having a plurality of conductive vias penetrating the first surface and the second surface; and an optoelectronic module disposed on the first surface of the electronic component and electrically connected to the plurality of conductive vias of the electronic component.

[0007] In the aforementioned electronic package, the electronic component is a switching application-specific integrated circuit.

[0008] In the aforementioned electronic package, the electronic component is electrically connected to the substrate through a plurality of conductive bumps on the second surface.

[0009] In the aforementioned electronic package, the optoelectronic module includes a package structure, a semiconductor element disposed in the package structure, and an optical element disposed on the package structure. In one embodiment, the semiconductor element is an integrated circuit element. In one embodiment, the optical element is an optical chip or an optical module. In one embodiment, the optical module includes a coupler, an optical chip, a total reflection mirror, and a fiber optic array unit.

[0010] In the aforementioned electronic package, the optoelectronic module is placed on the first surface of the electronic component and electrically connected to the electronic component through a conductive element disposed on the package structure.

[0011] In the aforementioned electronic package, a plurality of conductive elements are implanted on the second side of the substrate.

[0012] In the aforementioned electronic package, the substrate, the electronic component and the optoelectronic module constitute a three-layer vertical stacked structure.

[0013] As can be seen from the above, the electronic package of the present invention mainly forms a plurality of conductive vias in the electronic component, and places the electronic component on the substrate, and directly connects the optoelectronic module including the optical component and the semiconductor component on the electronic component, so that the optoelectronic module can be electrically connected to the electronic component and the substrate through the plurality of conductive vias, thereby shortening the electrical transmission path and reducing the data transmission loss. [Simplified Explanation of the Diagram]

[0029] Figures 1A and 1B are cross-sectional schematic diagrams and partial top view schematic diagrams of conventional co-packaged optical devices.

[0030] Figures 2A and 2B are cross-sectional and partial top views of the electronic package of the present invention.

Implementation Method

[0014] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0015] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "above," "first," "second," "third," and "one" used in this specification are only for the clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0016] Please refer to Figures 2A and 2B, which are cross-sectional schematic diagrams and partial top view schematic diagrams of the electronic package 2 of the present invention.

[0017] The electronic package includes a substrate 23, an electronic component 22 disposed on the substrate 23, and an optoelectronic module 21 disposed on the electronic component 22.

[0018] The substrate 23 is, for example, a core substrate with a core layer or a coreless substrate without a core layer, and has a first side 23a and a second side 23b opposite to each other.

[0019] In this embodiment, the substrate 23 includes an insulating layer 230 and a circuit layer 231 bonded to the insulating layer 230. The insulating layer 230 is made of dielectric materials such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer 231 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.

[0020] The electronic component 22 is disposed on the first side 23a of the substrate 23 and electrically connected to the substrate 23.

[0021] The electronic component 22 is, for example, a switch ASIC, having opposing first surfaces 22a and second surfaces 22b, and having a plurality of conductive vias 221 (e.g., conductive silicon vias) through the first surface 22a and the second surface 22b, and the electronic component 22 is electrically connected to the circuit layer 231 of the substrate 23 through the second surface 22b via a plurality of conductive bumps 222 (e.g., solder bumps or copper bumps).

[0022] The optoelectronic module 21 is disposed on the first surface 22a of the electronic component 22 and electrically connected to the plurality of conductive through holes 221 of the electronic component 22.

[0023] The optoelectronic module 21 includes a package structure 211, a semiconductor element 212 disposed in the package structure 211, and an optical element 213 disposed on the package structure 211. The package structure 211 is, for example, a fan-out stacked package structure (FO-PoP), the semiconductor element 212 is, for example, an electronic integrated circuit element (EIC), and the optical element 213 is, for example, an optical chip or an optical PIC module. The optical module includes a coupler, an optical chip, a total reflection mirror, a fiber optic array unit (FAU), etc.

[0024] The optoelectronic module 21 can be attached to the first surface 22a of the electronic component 22 through the conductive element 214 (e.g., solder bump or copper bump) provided on the packaging structure 211 and electrically connected to the electronic component 22. As shown in FIG2B, the positions of the plurality of conductive vias 221 of the electronic component 22 are located within the vertical projection area of ​​the optoelectronic module 21, so that the optoelectronic module 21 can directly use the conductive vias 221 of the electronic component 22 to electrically connect to the electronic component 22, the substrate 23 or other components, thereby shortening the electrical transmission path and reducing data transmission loss.

[0025] In addition, a plurality of conductive elements 24 (e.g., solder bumps or copper bumps) may be implanted on the second side 23b of the substrate 23 for subsequent electrical connection of the substrate 23 to the circuit board 20 through the plurality of conductive elements 24.

[0026] Accordingly, the electronic package of the present invention vertically stacks electronic components with a plurality of conductive through holes on a substrate, and then vertically stacks an optoelectronic module containing an EIC / PIC on the electronic components to form a three-layer vertically stacked electronic package, thereby accelerating electrical communication between them through vertical electrical connection of the three.

[0027] In summary, the electronic package of the present invention mainly forms a plurality of conductive vias in the electronic component, and places the electronic component on a substrate. A photoelectric module containing optical and semiconductor elements is directly connected to the electronic component, allowing the photoelectric module to be electrically connected to the electronic component and the substrate through the plurality of conductive vias, thereby shortening the electrical transmission path and reducing data transmission losses. Furthermore, this electronic package technology is highly feasible and can be manufactured using existing semiconductor packaging processes without the need to develop special processes or purchase special equipment, thus reducing product manufacturing costs.

[0028] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

Claims

1. An electronic package, comprising: The substrate has a first side and a second side facing each other; An electronic component has a first surface and a second surface opposite to each other, and is attached to a first side of a substrate with its second surface. The electronic component has a plurality of conductive vias penetrating the first surface and the second surface and is electrically connected to the substrate. An optoelectronic module is attached to the first surface of the electronic component and is electrically connected to the plurality of conductive vias, wherein the positions of the plurality of conductive vias are located within the vertical projection area of ​​the optoelectronic module.

2. The electronic package as described in claim 1, wherein, This electronic component is a conversion-type application-specific integrated circuit.

3. The electronic package as described in claim 1, wherein, The electronic component is electrically connected to the substrate via a plurality of conductive bumps on the second surface.

4. The electronic package as described in claim 1, wherein, The optoelectronic module includes a packaging structure, semiconductor elements disposed in the packaging structure, and optical elements disposed on the packaging structure.

5. The electronic package as described in claim 4, wherein, This semiconductor device is an integrated circuit element.

6. The electronic package as described in claim 4, wherein, The optical element is either an optical chip or an optical module.

7. The electronic package as described in claim 6, wherein, The optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.

8. The electronic package as described in claim 4, wherein, The optoelectronic module is connected to the first surface of the electronic component and electrically connected to the electronic component through a conductive element disposed on the packaging structure.

9. The electronic package as described in claim 1, wherein, A plurality of conductive elements are implanted on the second side of the substrate.

10. The electronic package as described in claim 1, wherein, The substrate, the electronic component, and the optoelectronic module constitute a three-layer vertically stacked structure.

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