Side optical couplers for advanced package architectures

TW202636156APending Publication Date: 2026-09-01LIGHTMATTER INC
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Patent Information

Application Number
TW114150270
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-11-25
Filing Date
2025-12-19
Publication Date
2026-09-01

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Abstract

A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide extending near a sidewall of the PIC, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug. A device may include an optical coupler between the sidewall of the PIC and the optical assembly, wherein the optical coupler is configured to couple light received from the waveguide to the fiber.
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