Dustproof film frame, dustproof film, exposure original with dustproof film, exposure method and semiconductor manufacturing method
TW202636212APending Publication Date: 2026-09-01SHIN ETSU CHEMICAL CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114138505
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-07
- Filing Date
- 2025-10-07
- Publication Date
- 2026-09-01
Smart Images

Figure TWG2TA001074340_001 
Figure TWG2TA001074340_002 
Figure TWG2TA001074340_003
Abstract
In the framework of dustproof films, particularly dustproof films for EUV exposure, an invention relates to a dustproof filter used with vents for rapidly reducing the pressure difference generated inside and outside the enclosed space of the dustproof film. The objective is to prevent a decrease in filter handleability due to the recent trend of thinning the filter thickness. In a dustproof film frame 2 having vents 5 for allowing air to pass through the enclosed space of the dustproof film, a filter 3 is provided to block at least a portion of the vents, and the overall thickness of the filter is at least 0.1 mm thicker than the thickness of the filter opening 10.
Need to check novelty before this filing date? Find Prior Art