Dustproof film frame, dustproof film, exposure original with dustproof film, exposure method and semiconductor manufacturing method

TW202636212APending Publication Date: 2026-09-01SHIN ETSU CHEMICAL CO LTD
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Patent Information

Application Number
TW114138505
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-07
Filing Date
2025-10-07
Publication Date
2026-09-01

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Patent Text Reader

Abstract

In the framework of dustproof films, particularly dustproof films for EUV exposure, an invention relates to a dustproof filter used with vents for rapidly reducing the pressure difference generated inside and outside the enclosed space of the dustproof film. The objective is to prevent a decrease in filter handleability due to the recent trend of thinning the filter thickness. In a dustproof film frame 2 having vents 5 for allowing air to pass through the enclosed space of the dustproof film, a filter 3 is provided to block at least a portion of the vents, and the overall thickness of the filter is at least 0.1 mm thicker than the thickness of the filter opening 10.
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