System and method for plasma pulsing scheme selection and optimization
TW202636234APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114140346
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-07-08
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-01
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Abstract
A method includes determining process parameters of a plasma process based on a desired objective function and determining a pulsing scheme of the plasma process based on the desired objective function. The pulsing scheme includes a pulsing petameter matrix including timing and power-level parameters of a radio frequency (RF) source power supply and a bias power supply. The method includes sending the process parameters and the pulsing scheme to a plasma apparatus, introducing a substrate into a process chamber of the plasma apparatus, and performing the plasma process on the substrate using the process parameters and the pulsing scheme.
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