Electronic device

Abstract

An electronic device includes a device body, a heat dissipation fin assembly, and a cover ring. The heat dissipation fin assembly includes a plurality of heat dissipation fins, wherein the heat dissipation fins are disposed at intervals on the device body and have a plurality of notches, the notches form at least one airflow channel, and an extension direction of each of the heat dissipation fins is inclined to the extension direction of the at least one airflow channel. The cover ring is connected to ends of the heat dissipation fins and surrounds the device body, wherein a plurality of airflow holes are formed between the cover ring, the device body, and the ends of the heat dissipation fins, each of the airflow holes has an air inlet and an air outlet opposite to each other, and a diameter of the air inlet is larger than a diameter of the air outlet. The air outlet of the invention has low air pressure and high flow rate, which can effectively improve heat dissipation efficiency.

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