Conductive film, method for producing filler arrayed film, connection structure, and method for producing connection structure

Abstract

This invention provides a conductive film that achieves high particle capture and stable conductivity even when anisotropic conductive films or similar conductive films are constructed by stacking two insulating resin layers to improve particle capture, and the stacked body contains conductive particles with a large particle size of 10 μm or more. Furthermore, resin overflow or adhesion is suppressed even after slicing. In this conductive film, which comprises a first insulating resin layer, a second insulating resin layer stacked thereon, and conductive particles with an average particle size of 10 μm or more, at least 90% of the conductive particles are arranged alternately on the conductive film, and the difference in resin flow rate between the first and second insulating resin layers is 0.07 to 0.09. Preferably, the viscosity at 80°C between the first and second insulating resin layers is less than 2.

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