Microelectromechanical switch device

Abstract

A microelectromechanical switch device includes a first substrate, a second substrate, and a bonding structure. The first substrate includes a first base, a first conductive via, and a signal layer. The first conductive via penetrates through the first base. The signal layer is connected to the first conductive via and is disposed on the first base. The second substrate includes a second base, a second conductive via, an insulating layer, and a switch structure layer. The second conductive via penetrates through the second base. The insulating layer is disposed between the second base and the switch structure layer and exposes the second conductive via. The switch structure layer includes a contact bump. The bonding structure bonds the first substrate and the second substrate, such that the contact bump of the switch structure layer contacts the signal layer to form an on-state. When the second conductive via generates electrostatic force due to bias voltage, causing the contact bump to separate from the signal layer, the on-state is switched to an off-state.

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