Processing system and method for processing substrate

TW202636481APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114138074
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-05
Filing Date
2025-10-02
Publication Date
2026-09-01

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    Figure TWG2TA001074332_003
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Abstract

A processing system may include a plasma chamber operable to generate a plasma, and an extraction assembly, arranged along a side of the plasma chamber. The extraction assembly may include a screen plate, disposed immediately adjacent to the side of the plasma chamber, the screen plate having an angled portion that comprises a screen aperture, to extract an angled ion beam towards a first end of the extraction assembly. The extraction assembly may also include an acceleration plate, disposed outside of the screen plate, the acceleration plate having a middle portion that is shaped according to an outer surface of the screen plate. As such, the acceleration plate may include an acceleration aperture, aligned with the screen aperture, and the acceleration plate may include a distal portion adjacent to the middle portion, the distal portion having a distal end that extends beyond an end of the screen plate.
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