Plasma uniformity control system and methods for processing a semiconductor substrate

Abstract

Methods and apparatus for processing a substrate using a plasma processing assembly. One example plasma processing assembly includes a processing chamber including a processing region, a plasma screen disposed within the processing region that forms a first region of the processing region and a second region of the processing region, a substrate support assembly disposed within the processing region, and a field generation system. The field generation system generally includes a first coil assembly including one or more first coils, where the one or more first coils are aligned in a first direction and at least partially encircle the processing region and where the first coil assembly is disposed inside the first region, and a second coil assembly including one or more second coils, where the one or more second coils at least partially encircle the processing region and the second coil assembly is disposed inside the second region.

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