Base and plasma treatment device

TW202636496APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114144180
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-11-11
Filing Date
2025-11-13
Publication Date
2026-09-01

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Abstract

This invention provides a base and plasma treatment apparatus for improving heat exchange efficiency. The base is disposed within a plasma treatment chamber and has an electrostatic chuck on its top surface. The base includes: a first recess with a first opening at its top; a second recess with a second opening at its top, disposed between the first recess and the second recess via a first partition wall; at least one first connecting channel connecting the first opening of the first recess to the second opening of the second recess; at least one refrigerant inlet communicating with the at least one first connecting channel; and at least one refrigerant outlet communicating with the at least one first connecting channel.
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