Improved substrate support for process chamber

TW202636497APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114144283
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-11-13
Publication Date
2026-09-01

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Abstract

A substrate support assembly is provided, including: a substrate support that includes a lower portion and an upper portion; an electrode disposed in the upper portion; a heater disposed in the upper portion; and a plurality of spacers positioned between the lower portion and the upper portion to form a gap between the upper portion and the lower portion. The gap is open to allow gas to flow from outside the substrate support and through the gap.
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