Plasma treatment unit

TW202636500APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115105596
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-02-10
Filing Date
2026-02-12
Publication Date
2026-09-01

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Abstract

A plasma processing apparatus includes: a plasma processing chamber; a substrate support disposed within the plasma processing chamber; an upper electrode assembly disposed above the substrate support; and a magnetic field generating unit disposed above the upper electrode assembly; the magnetic field generating unit includes: a plurality of electromagnet units, each having a top surface disposed along a coplanar plane, and each electromagnet unit includes an electromagnet and a yoke that at least partially covers the electromagnet; a cooling plate in contact with the top surface of the plurality of electromagnet units; and at least one additional yoke extending downward from at least one of the plurality of electromagnet units.
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