Plasma processing apparatus, substrate processing system and fixture

TW202636502APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115119601
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-13
Filing Date
2024-06-26
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001075419_001
    Figure TWG2TA001075419_001
  • Figure TWG2TA001075419_002
    Figure TWG2TA001075419_002
  • Figure TWG2TA001075419_003
    Figure TWG2TA001075419_003
Patent Text Reader

Abstract

This invention provides a technique for facilitating the loading and unloading of components between plasma processing apparatuses or substrate processing systems. The invention provides a plasma processing apparatus having a processing chamber. The apparatus includes: a first component; a second component; and a fixture that secures the first and second components in an axially detachable manner, and includes a male component and a female component; the male component is fixed to the first component; the female component is fixed to the second component and receives the male component. The male component includes a shaft member extending axially and having an increased radius at its front end. The female component includes: a receiving member fixed to the second component; a holding member disposed within the receiving member; and a spherical member held by the holding member. The spherical member, when the holding member moves axially and toward the opening (i.e., a first direction), is guided inward in a radial direction by a push-out portion of the inner wall of the receiving member.
Need to check novelty before this filing date? Find Prior Art