Plasma processing apparatus, substrate processing system and fixture
TW202636502APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW115119601
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-13
- Filing Date
- 2024-06-26
- Publication Date
- 2026-09-01
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Abstract
This invention provides a technique for facilitating the loading and unloading of components between plasma processing apparatuses or substrate processing systems. The invention provides a plasma processing apparatus having a processing chamber. The apparatus includes: a first component; a second component; and a fixture that secures the first and second components in an axially detachable manner, and includes a male component and a female component; the male component is fixed to the first component; the female component is fixed to the second component and receives the male component. The male component includes a shaft member extending axially and having an increased radius at its front end. The female component includes: a receiving member fixed to the second component; a holding member disposed within the receiving member; and a spherical member held by the holding member. The spherical member, when the holding member moves axially and toward the opening (i.e., a first direction), is guided inward in a radial direction by a push-out portion of the inner wall of the receiving member.
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