Connection pin module for high-frequency signal transmission

Abstract

A connection pin module for high-frequency signal transmission, comprising: a metal body and a plurality of signal transmitters. The metal body includes a plurality of through channels, each signal transmitter being disposed in a corresponding channel. Each signal transmitter comprises a signal connection pin and a non-conductive medium. The non-conductive medium is arranged around the signal connection pin to isolate it from the wall surface of the channel. Accordingly, the connection pin module is arranged with a specialized configuration and corresponding materials, effectively reducing signal interference and preventing it from becoming a bottleneck in improving transmission rates.

Description

Technical Field

[0001] This disclosure relates to a connector module, and more particularly to a connector module for high-frequency signal transmission. Prior Technology

[0002] During transmission, signals often pass through various connector modules, which are used to connect different interfaces or devices.

[0003] As the demand for data transmission increases, higher frequencies are needed to increase bandwidth and transmit more data per unit time, thereby achieving higher transmission rates. However, this high-frequency requirement makes traditional connector modules a variable in improving transmission rates. This is because high-frequency signals (e.g., RF signals) require precise impedance matching, which can be affected by the configuration of the transmission interface.

[0004] Eliminating various possible interferences along the signal transmission path is usually quite complex. Although the connector module is only a connection interface, if these connector modules can have low interference characteristics, the transmission of high-frequency signals will become more stable. Therefore, a connector module suitable for high-frequency signal transmission is needed. Summary of the Invention

[0005] The connector pin module in some embodiments of this disclosure provides a configuration suitable for high-frequency signal transmission.

[0006] According to some embodiments, a connector module for high-frequency signal transmission is proposed, comprising: a metal body and a plurality of signal transmitters. The metal body includes a plurality of through channels. The signal transmitters are respectively disposed in corresponding channels. Each signal transmitter includes signal connector pins and a non-conductive medium. The non-conductive medium is disposed around the signal connector pins to separate the signal connector pins from the walls of the channels.

[0007] According to some embodiments, the metal body may include a first body and a second body joined together. The wall of the channel of the first body may include a first stepped portion. The wall of the channel of the second body may include a second stepped portion. A non-conductive medium may be prevented from detaching upwards by a stop in the first stepped portion. Furthermore, a non-conductive medium may be prevented from detaching downwards by a stop in the second stepped portion.

[0008] According to some embodiments, the periphery of the first body may include a downwardly extending extension. The extension may define a recess on the bottom side of the first body, and the second body is disposed within the recess.

[0009] According to some embodiments, a non-conductive medium may include a protruding section on the upper surface of the first body. The protruding section withstands the downward pressure of the upper contact plate through a second stepped portion, thereby maintaining a predetermined distance between the first body and the contact plate.

[0010] According to some embodiments, the protruding section protrudes from the upper surface of the first body by no more than 0.4 mm. Alternatively, it protrudes by about 0.2 mm. Or, it protrudes by 0.16 mm to 0.24 mm.

[0011] According to some embodiments, the non-conductive medium may include a first dielectric portion and a second dielectric portion. The first dielectric portion is disposed within a channel of the first body, and the second dielectric portion is disposed within a channel of the second body.

[0012] According to some embodiments, the material of the non-conductive medium may include at least Teflon.

[0013] According to some embodiments, the metal body may be made of brass or aluminum.

[0014] According to some embodiments, a plurality of grounding connection pins may be included. The metal body further includes a plurality of blind holes. The blind holes are disposed around corresponding channels, and the grounding connection pins are respectively disposed in the corresponding blind holes and include telescopic portions protruding from the blind holes.

[0015] According to some embodiments, the blind hole is configured as a through upper blind hole portion in the first body and as a non-through lower blind hole portion in the second body.

[0016] According to some embodiments, both the signal connection pin and the ground connection pin can be spring-loaded pins (Pogo pins).

[0017] Accordingly, the connector module is arranged in a special configuration and with appropriate materials so that it is suitable for high-frequency signal transmission and will not become a bottleneck for improving transmission rate. Simple Explanation of the Diagram

[0018] [Figure 1] is a perspective view of a connecting pin module according to some embodiments. [Figure 2] is a top view of the embodiment in Figure 1. [Figure 3] is a cross-sectional view along line segment AA of the embodiment in Figure 2. [Figure 4] is a cross-sectional view along line BB of the embodiment in Figure 2. [Figure 5] is a partially enlarged schematic diagram based on Figure 3. Implementation

[0019] To fully understand the purpose, features, and effects of the content disclosed herein, the following specific embodiments, along with the accompanying drawings, will be used to provide a detailed explanation of the content disclosed herein, as follows:

[0020] In this document, the terms "a" or "an" are used to describe an element or feature. This is for convenience of explanation and to provide a general meaning for the scope of this document. Therefore, unless it is clearly intended otherwise, such a description should be understood to include one or at least one, and the singular includes the plural.

[0021] In this document, the terms “comprising,” “including,” “having,” or any other similar terms used are not limited to the elements or features listed herein, but may include other parts not expressly listed but which are generally inherent in the elements or features.

[0022] In this document, the use of ordinal terms such as "first" or "second" is used to distinguish or refer to elements or features that are related to the same or similar elements or features, and does not necessarily imply a spatial order of these elements or features. It should be understood that in certain situations or configurations, ordinal terms may be used interchangeably without affecting the embodiments disclosed herein or associated with them.

[0023] Please refer to Figure 1, which is a perspective view of a connector module according to some embodiments. The connector module is typically mounted on a support 300, and the connector module provides electrical connection terminals on its upper and lower sides for corresponding parts to connect to. In other words, the connector module provides a medium for establishing the required electrical connection path between devices, components, or other devices via terminals.

[0024] For example, the carrier plate of the device under test (not shown) located above the connector module can contact the connector module to form an electrical connection. Alternatively, the carrier plate of the device under test can form a stable electrical connection with the connector module by applying downward pressure. On the other hand, the lower part of the connector module can establish an electrical connection with the control device at the back end by connecting a transmission line or contacting another carrier plate.

[0025] As shown in Figure 1, the connector module includes a metal body 100, a signal transmitter 210, a low-frequency signal transmitter 220, and a grounding connector 230. The signal transmitter 210 includes a signal connector 211 and a non-conductive dielectric 212. The non-conductive dielectric 212 surrounds the signal connector 211 to form a surrounding enclosure. The low-frequency signal transmitter 220 also has a non-conductive dielectric 222 surrounding the low-frequency signal connector 221. The grounding connectors 230 are arranged in an array evenly around the periphery of the signal transmitter 210.

[0026] As can be seen from Figure 1, the thickness of the non-conductive medium 222 surrounding the low-frequency signal transmitter 220 is thinner than the thickness of the non-conductive medium 212 surrounding the signal connection pin 211. This is because the low-frequency signal transmitter 220 is typically used to transmit low-frequency signals (e.g., hundreds of MHz or lower), and its impedance requirements are less stringent, allowing for a reduction in thickness to decrease the overall size. On the other hand, the signal transmitter 210 is used to transmit high-frequency signals (e.g., GHz levels, such as 7.5 Gbps), and its impedance matching requirements are precise; therefore, in the configuration of this invention, a thicker non-conductive medium 212 is used. Furthermore, the ground connection pin 230 illustrated in Figure 1 may also be omitted in some embodiments where it is not required.

[0027] The non-conductive media 212 and 222 can be configured as Teflon, i.e., polytetrafluoroethylene (PTFE), which is a high-performance non-conductive medium. However, in some other embodiments, other types of non-conductive media can also be used.

[0028] In some embodiments of the present invention, the main body of the connector module is equipped with a metal body 100, which includes a channel 101 penetrating through it, and the signal transmitter 210 is disposed in the channel 101. The signal connector 211 can be isolated from the wall of the channel 101 by being surrounded by a non-conductive medium 212. The metal body 100 can be made of brass or aluminum, etc. In this basic structural configuration, the signal connector 211 is essentially arranged within a metal block. Through the diameter of the channel 101 and the matching non-conductive medium 212, the impedance matching of the signal connector 211 can be precisely controlled, thereby enabling the connector module to transmit high-frequency signals.

[0029] Next, please refer to Figures 1 to 4 simultaneously. Figure 2 is a top view of the embodiment in Figure 1, Figure 3 is a cross-sectional view along line segment AA of the embodiment in Figure 2, and Figure 4 is a cross-sectional view along line segment BB of the embodiment in Figure 2.

[0030] The metal body 100 can be configured to include a first body 110 and a second body 120. The first body 110 and the second body 120 are joined together. In the embodiments shown in Figures 1 to 4, the second body 120 is embedded in the first body 110. This configuration can provide a larger coverage and shielding of the joint surface between the first body 110 and the second body 120 by surrounding the first body 110, which helps to improve the quality of signal transmission. In addition, for the channel 102, approximately half of the channel 102 may be formed in the first body 110, and the remaining part may be formed in the second body 120. In other embodiments, different allocation ratios are also possible. Compared to the second body 120, the allocation method is that a larger portion (greater than 50%) of the channel 102 is allocated in the first body 110. For example, based on the overall depth of the channel 102, 2 / 3 of the depth is allocated in the first body 110.

[0031] The periphery of the first body 110 is covered around the second body 120 by the downwardly extending extension 115, and the extending extension 115 can define a recess on the bottom side of the first body 110, so that the second body 120 can be embedded into the inside of the first body 110 and positioned in the recess.

[0032] Next, please refer to Figures 2 through 5 simultaneously. Figure 5 is a partially enlarged schematic diagram based on Figure 3. The wall surface of the channel 101 formed within the first body 110 includes a first stepped portion 111. The wall surface of the channel 101 formed within the second body 120 includes a second stepped portion 121. The non-conductive dielectric 212 can be matched with the first body 110 and the second body 120 and is divided into: a first dielectric portion 212a disposed within the channel of the first body 110, and a second dielectric portion 212b disposed within the channel of the second body 120.

[0033] The non-conductive dielectric 212 can be fixed and limited by the stepped portion formed on the wall of the channel 101. The first dielectric part 212a is prevented from detaching upward from the channel 101 by the stop of the first stepped part 111, and the second dielectric part 212b is prevented from detaching downward from the channel 101 by the stop of the second stepped part 121. The stepped portion is formed by a stepped structural variation constructed on the wall surrounding the channel 101. This structural configuration also facilitates assembly and future maintenance.

[0034] As shown in Figures 3 and 5, the first dielectric portion 212a of the non-conductive dielectric 212 includes a protruding section on the upper surface of the first body 110. This protruding section provides distance control between the contact plate (or carrier plate) above the connecting pin module and the upper surface of the metal body 100. When the contact plate is pressed down to establish a contact-type electrical connection, the maximum downward pressure of the contact plate is limited by the protruding section of the first dielectric portion 212a and the second stepped portion 121. That is, the protruding section can support the contact plate, limiting its downward pressure stroke to maintain a predetermined distance between the first body 110 and the contact plate.

[0035] The degree of protrusion of this protrusion (which determines the predetermined distance between the carrier plate and the metal body 100) also affects the quality of signal transmission. In some embodiments, the protrusion may be configured such that the height d protruding from the upper surface of the first body 110 does not exceed 0.4 (mm). In some embodiments, the protrusions of each non-conductive dielectric 212 on the metal body 100 may be configured such that the overall average height d is approximately 0.2 (mm). Furthermore, in some other embodiments, the protrusion may be configured such that the height d protruding from the upper surface of the first body 110 is approximately 0.16 (mm) to 0.24 (mm).

[0036] Next, referring to Figure 4, a plurality of grounding connection pins 230 can be further configured in the metal body 100. These grounding connection pins 230 are configured in a corresponding blind hole 103, which is a recessed hole formed downward from the upper surface of the metal body 100. Each blind hole 103 is configured around the corresponding channel 102, and the array-arranged blind holes 103 ensure that the positions adjacent to the channel 102 all have grounding connection pins 230. Similarly, as with the configuration of the channel 102, for the blind hole 103, approximately half of the blind hole 103 can be formed in the first body 110, and the remaining part can be formed in the second body 120. In other embodiments, different allocation ratios are also possible.

[0037] In some embodiments of the present invention, both the signal connection pin 211 and the ground connection pin 230 may be configured as pogo pins. The ground connection pin 230 includes a telescopic portion with a protruding blind hole 103. With the aforementioned protruding portion, the appropriate telescopic portion of the ground connection pin 230 can also ensure a contact-type electrical connection between the ground connection pin 230 and the contact plate.

[0038] In summary, the connector module is arranged in a special configuration and with appropriate materials. Under this basic structure, the degree of interference to the signal can be reduced, thus making it suitable for high-frequency signal transmission and avoiding the connector module becoming a bottleneck in improving the transmission rate.

[0039] In this document, the terms "approximately," "about," "approximately," "substantially," or "basically" generally refer to "any approximation of a given value" or "any approximation of a given range." These approximations will vary depending on the relevant field, and their range should be consistent with the broadest interpretation understood by one of ordinary skill in the art to cover similar implementations and all modifications based on such variations. In some embodiments, it generally refers to within twenty percent of a "given value" or "given range," further within ten percent, and even further within five percent. The numerical quantities given herein are approximate, meaning that unless explicitly stated otherwise, these values ​​can be inferred to fall within the categories of "approximately," "about," "approximately," "substantially," or "basically," or imply the inclusion of other approximations.

[0040] The preferred embodiments disclosed above are intended to illustrate the content of this document. However, those skilled in the art should understand that these embodiments are merely illustrative of the disclosure and should not be construed as limiting the scope. It should be noted that all variations and substitutions equivalent to these embodiments should be considered within the scope of this disclosure. Therefore, the protection scope of this disclosure is determined by the claims.

[0041] 100:Metal body 101: Channel 102: Channel 103: Blind Hole 110:First body 111: First Step 115: Extension 120: Second Body 121: Second Step 210: Signal Transmitter 211: Signal connection pin 212: Non-conductive medium 212a: First Medium Section 212b: Second Medium Section 220: Low-frequency signal transmitter 221: Low-frequency signal connection pin 222: Non-conductive dielectric 230: Grounding connection pin 300: Bracket d: height

Claims

1. A connector module for high-frequency signal transmission, comprising: a metal body including a plurality of through channels; and a plurality of signal transmitters respectively disposed in the corresponding channels, each signal transmitter including a signal connector and a non-conductive medium disposed around the signal connector to separate the signal connector from the wall of the channel.

2. The connecting pin module as claimed in claim 1, wherein the metal body includes a first body and a second body assembled together, the wall of each channel of the first body includes a first step portion, the wall of each channel of the second body includes a second step portion, the non-conductive medium is prevented from detaching upward by the stop of the first step portion, and the non-conductive medium is prevented from detaching downward by the stop of the second step portion.

3. The connector module as described in claim 2, wherein the periphery of the first body includes a downwardly extending extension that defines a recess on the bottom side of the first body, and the second body is disposed within the recess.

4. The connecting pin module as described in claim 2, wherein the non-conductive medium includes a protruding section on an upper surface of the first body, the protruding section bearing a pressure from an upper contact plate by the second step portion to maintain the first body and the contact plate at a predetermined distance.

5. The connector module as described in claim 4, wherein each of the protrusions protrudes from the upper surface of the first body by no more than 0.4 mm.

6. The connecting pin module as described in claim 4, wherein each of the protruding segments protrudes from the upper surface of the first body by 0.16 (mm) to 0.24 (mm).

7. The connector module as claimed in claim 4, wherein the non-conductive medium includes a first dielectric portion and a second dielectric portion, the first dielectric portion being disposed within the channel of the first body, and the second dielectric portion being disposed within the channel of the second body.

8. The connector module as described in any one of claims 1 to 7, wherein the material of the non-conductive medium includes at least Teflon.

9. The connector module as described in claim 8, wherein the metal body is made of brass or aluminum.

10. The connector module as described in claim 9, wherein the signal connector is a pogo pin.

11. The connector module as claimed in claim 9, further comprising a plurality of grounding connectors, the metal body further comprising a plurality of blind holes, each blind hole being disposed around a corresponding channel, each grounding connector being disposed in a corresponding blind hole and including a telescopic portion protruding from the blind hole.

12. The connection pin module as described in claim 11, wherein the grounding connection pin is a pogo pin.

13. The connector module as claimed in claim 2, further comprising a plurality of grounding connectors, the metal body further comprising a plurality of blind holes, each blind hole being disposed around a corresponding channel, each grounding connector being disposed in a corresponding blind hole, each blind hole being an upper blind hole portion that is through in the first body, and each blind hole being a lower blind hole portion that is not through in the second body.

14. The connector module as described in claim 13, wherein the material of the non-conductive medium includes at least Teflon.

15. The connector module as described in claim 14, wherein the metal body is made of copper or aluminum.

16. The connector module as described in claim 15, wherein the signal connector and the ground connector are pogo pins.

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