Heat treatment apparatus and heat treatment method

TW202636692APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW114149493
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-20
Filing Date
2025-12-16
Publication Date
2026-09-01

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    Figure TWG2TA001074911_003
Patent Text Reader

Abstract

One embodiment of a heat treatment apparatus includes: a first heating section 1 in which a granular heating resistor 2 is internally disposed; a heating resistor supply section 3 connected to the first heating section 1 and supplying the heating resistor 2 to the first heating section 1; a heating resistor removal section 4 connected to the first heating section 1 and removing the heating resistor 2 from the first heating section 1; a processing object supply section 5 connected to the first heating section 1 and supplying a processing object 7 to the first heating section 1; and a processing object removal section 6 connected to the first heating section 1 and removing the processing object 8 from the first heating section 1.
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