Wiring board

Abstract

The present invention aims to provide a wiring substrate (1) capable of arranging more wirings on the same layer. The wiring substrate (1) is a semiconductor device (1) in which a plurality of bump solder joints (20) and a plurality of surface layer through-hole solder joints (30) are provided on the surface layer (10). On the surface layer (1), there is a bump solder joint portion (18). On the bump solder joint portion (18), a plurality of bump solder joint rows (100) formed by at least a portion of the plurality of bump solder joints (20) arranged side by side are formed, and at least one through-hole solder joint row (120) formed by at least a portion of the plurality of surface layer through-hole solder joints (30) arranged side by side is formed. The bump solder joint row (100) and the through-hole solder joint row (120) are parallel, and one through-hole solder joint row (120) is arranged relative to two bump solder joint rows (100).

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