Stacked system modules and their welding methods

Abstract

This disclosure provides a stacked system module and its soldering method. The system module includes a first substrate, a carrier plate, and a second substrate stacked sequentially along a first direction. The first substrate includes a first surface and a second surface disposed opposite to each other, and the second surface is provided with a first pad. The second substrate includes a third surface and a fourth surface disposed opposite to each other, wherein the third surface faces the second surface and the third surface is provided with a second pad. The carrier plate includes an opening and a connector, wherein, along the first direction, the projections of the first pad and the second pad are both located around the projection of the opening, and the connector is used to make a portion of the first pad and a portion of the second pad electrically connected through the connector.

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