Circuit board mounting method and related device

TW202636708APending Publication Date: 2026-09-01HON HAI PRECISION INDUSTRY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114114677
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-18
Filing Date
2025-04-17
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074167_001
    Figure TWG2TA001074167_001
  • Figure TWG2TA001074167_002
    Figure TWG2TA001074167_002
  • Figure TWG2TA001074167_003
    Figure TWG2TA001074167_003
Patent Text Reader

Abstract

The present application provides a circuit board mounting method and related devices. The circuit board mounting method includes: obtaining product parameters of a circuit board; forming a plurality of first welding spots on the circuit board based on a plurality of coordinates of the first welding spots, and forming a plurality of second welding spots on the circuit board based on a plurality of coordinates of the second welding spots; recognizing positions of the first welding spots on the circuit board; matching a circuit board coordinate system based on the positions of the first welding spots on the circuit board and the plurality of coordinates of the first welding spots; and mounting the circuit board based on the matched circuit board coordinate system and the coordinates of the second welding spots.
Need to check novelty before this filing date? Find Prior Art