Substrate manufacturing method

Abstract

A method for manufacturing a substrate is provided, which enables easy separation of a carrier and a device layer. The method includes: preparing a laminate on a carrier having a release layer and a device layer sequentially disposed thereon; depositing a resin layer comprising a curable resin on the carrier-side surface of the laminate to obtain a resin-attached laminate; causing the resin layer to shrink by curing the resin-attached laminate with the curable resin, thereby stretching the carrier in the direction of resin layer shrinkage, thus changing the shape of the carrier or the resin-attached laminate; and utilizing the shape change of the carrier to generate shear stress between the carrier and the device layer, thereby peeling the device layer from the resin-attached laminate at the release layer location.

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