Electronic device housing and manufacturing method thereof

Abstract

An electronic device housing is provided. The electronic device housing has an outer side surface and an inner side surface opposite each other. The outer side surface has a plurality of blind holes formed thereon, and there has at least on through hole formed at the bottom surface of each of the blind hole penetrates the housing and reaches the inner side surface. A manufacture method for the electronic device housing is also provided.

Description

[Technical Field]

[0001] This case relates to the casing of an electronic device and a method of manufacturing the same, and more particularly to a casing of an electronic device with perforations and a method of manufacturing the same. [Previous Technology]

[0002] Traditional electronic devices, such as speakers, require drilling holes in their casings for sound generation or heat dissipation, which often results in noticeable hole areas and shadows on the appearance of the electronic devices, affecting their overall appearance. [Summary of the Invention]

[0003] This invention provides an electronic device housing. The electronic device housing has an outer side and an inner side. A plurality of blind holes are formed on the outer side, and each blind hole has at least one through-hole on its bottom surface, extending through to the inner side.

[0004] This invention also provides a method for manufacturing an electronic device housing. This manufacturing method includes the following steps: First, a housing is provided, the housing having an outer side and an inner side. Then, a plurality of blind holes are formed on the outer side. Next, at least one through hole is formed on the bottom surface of each blind hole, extending through to the inner side.

[0005] The electronic device casing provided in this case has a blind hole formed on its outer side, and a perforation is formed on the bottom surface of the blind hole to extend to the inner side, which can effectively hide the hole area and improve the appearance of the electronic device.

Implementation Method

[0006] The specific embodiments of this case will be described in more detail below with reference to the schematic diagrams. The advantages and features of this case will become clearer based on the following description and the scope of the patent application. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this case.

[0007] Figures A and B are partial top views and partial cross-sectional views of an electronic device housing provided according to an embodiment of the present invention. The electronic device housing 100 may be a laptop housing, a speaker housing, or other housings of electronic devices with heat dissipation or sound emission functions.

[0008] As shown in the figure, the housing 110 of this electronic device housing 100 has an outer side 101 and an inner side 102. The outer side 101 is the outer surface of the housing 110 of the electronic device housing 100. This housing 110 can be made of metal materials (such as aluminum alloy, aluminum-magnesium alloy, etc.), plastic materials, or composite materials.

[0009] A plurality of blind holes 120 are formed on the outer surface 101, and at least one through hole 130 is formed on the bottom surface 122 of each blind hole 120 (a single through hole 130 is formed in the figure as an example), extending to the inner surface 102. In one embodiment, these blind holes 120 may be arranged in an array on the outer surface 101.

[0010] In this embodiment, the opening shape of the blind hole 120 is the same as the opening shape of the through hole 130, both being circular, and the diameter D1 of the blind hole 120 is larger than the diameter D2 of the through hole 130. Furthermore, the through hole 130 is located at the center of the bottom surface 122 of the blind hole 120. However, this embodiment is not limited to this. Depending on actual needs, the shape of the blind hole 120 is not limited to a circle; it can also be square, triangular, hexagonal, elongated, etc., and the opening shape of the blind hole 120 can be different from the opening shape of the through hole 130. A plurality of through holes 130 can be formed on the bottom surface 122 of the blind hole 120, symmetrically arranged.

[0011] In one embodiment, the aperture D1 of the blind hole 120 is 1.4 to 4 times the aperture D2 of the through hole 130. In one embodiment, the depth T1 of the blind hole 120 is between 1 / 4 and 3 / 4 of the thickness T2 of the outer casing 100. However, it is not limited to this.

[0012] In one embodiment, as shown in the figure, an outer surface 101 surrounding the opening of the blind hole 120 is covered with an appearance layer 140, and an inner covering layer 150 is covered within the blind hole 120. The covering layer 150 extends from the bottom surface 122 of the blind hole 120 and covers the sidewall 124 of the blind hole 120. The color of the covering layer 150 is darker than that of the appearance layer 140. The presence of the covering layer 150 can effectively hide the perforation 130 (i.e., the hole area) located on the bottom surface 122 of the blind hole 120, thereby helping to improve the appearance of the electronic device.

[0013] In one embodiment, different colored paints can be used to form the appearance layer 140 and the masking layer 150. Specifically, the appearance layer 140 can be a first color paint layer, and the masking layer 150 can be a second color paint layer, the color of the second color paint layer being darker than the color of the first color paint layer.

[0014] Specifically, a paint with a lower grayscale can be used to create the masking layer 150, and a paint with a higher grayscale can be used to create the appearance layer 140, so that the masking layer 150 appears to be a darker color. For example, according to the definition of the CIELAB color space, the L value of the color of the masking layer 150 can be set to be lower than 31, and the a and b values ​​can also be lower than 31. The L value of the color of the appearance layer 140 can be set to be higher than the L value of the color of the masking layer 150.

[0015] In other embodiments, a coating with low light reflectivity can be used to make the shielding layer 150, and a coating with high light reflectivity can be used to make the appearance layer 140, so as to hide the perforation 130 (i.e., the hole area) located on the bottom surface 122 of the blind hole 120.

[0016] The foregoing embodiments describe the formation of the masking layer 150 and the appearance layer 140 using coatings; however, this invention is not limited thereto. In other embodiments, surface treatment methods, such as anodizing, can also be used to form the masking layer 150 and the appearance layer 140 on the housing 100. Anodizing can be used in conjunction with dyes to give the anodized layer color. Specifically, the appearance layer 140 can be a first anodized layer, and the masking layer 150 can be a second anodized layer. The color of the second anodized layer is darker than that of the first anodized layer.

[0017] Please refer to Figures 2A to 2G, which show a method for manufacturing an electronic device housing 200 according to an embodiment of this invention. In this embodiment, colored paint is used to color the outer side 201 of the housing 210 and the bottom surface 222 of the blind hole 220.

[0018] First, as shown in Figure 2A, a housing 210 is provided, the housing 210 having an outer side 201 and an inner side 202. The outer side 201 is the outer surface of this housing 210. This housing 210 can be made of a metallic material (such as aluminum alloy, aluminum-magnesium alloy, etc.), a plastic material, or a composite material.

[0019] Subsequently, as shown in Figure 2B, a plurality of blind holes 220 are formed on the outer surface 201. In one embodiment, the plurality of blind holes 220 can be formed on the outer surface 201 by means of machining, such as drilling, and these blind holes 220 can be arranged in an array on the outer surface 201.

[0020] Then, as shown in Figure 2C, at least one through hole 230 (a single through hole 230 is formed in the figure as an example) is formed on the bottom surface 222 of each blind hole 220, extending to the inner surface 202. In one embodiment, at least one through hole 230 can be formed on the bottom surface 222 of each blind hole 220 by means of machining, such as drilling.

[0021] In another embodiment, the blind hole 220 or the through hole 230 can be formed by chemical etching, but this case is not limited thereto.

[0022] In this embodiment, a single through hole 230 is formed on the bottom surface 222 of each blind hole 220, and the through hole 230 is located in the middle of the bottom surface 222 of the blind hole 220. However, this embodiment is not limited to this. In other embodiments, depending on actual needs, the shape of the blind hole 220 may be different from that of the through hole 230, and multiple through holes 230 may be formed on the bottom surface 222 of each blind hole 220.

[0023] Next, as shown in Figure 2D, the outer surface 201 is colored. In one embodiment, a first paint layer 240a (i.e., the appearance layer 240) can be formed on the outer surface 201 by spraying or other processing methods. However, it is not limited to this.

[0024] Then, as shown in Figure 2E, a protective layer 245 is formed to cover the outer surface 201. This protective layer 245 may be a removable coating or tape.

[0025] Next, as shown in Figure 2F, the blind hole 220 is colored, so that the bottom surface 222 of the blind hole 220 is darker than the outer surface 201. In one embodiment, a single color paint material can be applied to the entire housing 210 (including the blind hole 220) using spray painting or other processing methods. The portion of the outer surface 201 of the housing 210 covered by the protective layer 245 retains its original color (i.e., the color of the first color paint layer 240a). The portion of the paint material extending into the blind hole 220 is the second color paint layer 250a (i.e., the masking layer 250). This second color paint layer 250a covers not only the bottom surface 222 of the blind hole 220 but also the sidewall 224 of the blind hole 220. The color of this second color paint layer 250a is darker than the first color paint layer 240a.

[0026] Then, as shown in Figure 2G, the protective layer 245 covering the outer surface 201 is removed, exposing the first paint layer 240a (i.e., the appearance layer 240).

[0027] Please also refer to Figures 3A to 3E, which show a method for manufacturing an electronic device housing 300 according to another embodiment of this invention. In this embodiment, an anodizing process is used to color the outer side 301 of the housing 310 and the bottom surface 322 of the blind hole 320.

[0028] As shown in Figure 3A, firstly, a housing 310 is provided, which has an outer side 301 and an inner side 302. The outer side 301 is the outer surface of this housing 310. This housing 310 can be made of a metal material (such as aluminum alloy, aluminum-magnesium alloy, etc.), a plastic material, or a composite material.

[0029] Subsequently, as shown in Figure 3B, the housing 310 is subjected to a first anodizing treatment, and a first anodized layer 340a (i.e., the outer appearance layer 340) is formed on the outer surface 301.

[0030] Subsequently, as shown in Figure 3C, a plurality of blind holes 320 are formed on the outer surface 301. These blind holes 320 penetrate the first anodized layer 340a, exposing the substrate of the housing 310.

[0031] Then, as shown in Figure 3D, at least one through hole 330 is formed on the bottom surface 322 of each blind hole 320 (the figure shows a single through hole 330 as an example), extending through to the inner surface 302.

[0032] Next, as shown in Figure 3E, the housing 310 undergoes a second anodizing process, forming a second anodized layer 350a (i.e., a shielding layer 350) on the inner side 302 of the blind hole 320. This second anodized layer 350a covers not only the bottom surface 322 of the blind hole 320 but also the sidewall 324 of the blind hole 320. The color of this second anodized layer 350a is darker than that of the first anodized layer 340a.

[0033] Figure 4 is a partial cross-sectional view of the electronic device housing 400 provided according to another embodiment of the present invention.

[0034] As shown in the figure, the housing 410 of the electronic device housing 400 has an outer side 401 and an inner side 402. The outer side 401 is formed with a plurality of blind holes 420, and the bottom surface 422 of each blind hole 420 is formed with at least one through hole 430 (a single through hole 430 is formed in the figure as an example), which extends to the inner side 402.

[0035] In the embodiment shown in Figure 1B, the shielding layer 150 completely covers the inner surface 102 of the blind hole 120, that is, it extends from the bottom surface 122 of the blind hole 120 to cover the side wall 124 of the blind hole 120. In contrast, the shielding layer 450 in this embodiment only covers the bottom surface 422 of the blind hole 420, and does not cover the side wall 424 of the blind hole 420.

[0036] Other structures of the electronic device housing 400 in this embodiment, such as the outer layer 440, are similar to the corresponding structures in the embodiment of Figure 1B, and will not be described in detail here.

[0037] The electronic device housings 100, 200, 300, and 400 provided in this case have a blind hole 420 formed on the outer side 401, and a through hole 430 formed on the bottom surface 422 of the blind hole 420 extending to the inner side 402, which can effectively hide the hole area and improve the appearance of the electronic device.

[0038] The above is merely a preferred embodiment of this case and does not limit the scope of this case in any way. Any equivalent substitution or modification made by a person skilled in the art to the technical means and technical content disclosed in this case without departing from the scope of the technical means of this case shall be deemed as not departing from the technical means of this case and shall still fall within the protection scope of this case. [Simplified Explanation of the Diagram]

[0039] Figures A and B are partial top views and partial cross-sectional views of an electronic device housing provided according to an embodiment of the present invention; Figures A to G show a method of manufacturing an electronic device housing provided according to an embodiment of the present invention; Figures A to E show a method of manufacturing an electronic device housing provided according to another embodiment of the present invention; and Figure 4 is a partial cross-sectional view of an electronic device housing provided according to another embodiment of the present invention.

Claims

1. An electronic device housing having an outer side and an inner side, the outer side having a plurality of blind holes, and each blind hole having at least one through hole on its bottom surface extending to the inner side, wherein... The bottom surface is covered with a masking layer, which is either a first color paint layer or a first anodized layer. The outer surface around the opening of the blind hole is covered with an appearance layer, which is either a second color paint layer or a second anodized layer. The grayscale of the masking layer is lower than that of the appearance layer.

2. The electronic device housing as described in claim 1, wherein, The light reflectivity of the shielding layer is lower than that of the outer layer.

3. The electronic device housing as described in claim 1, wherein, The shielding layer extends from the bottom surface and covers the side of the blind hole.

4. The electronic device housing as described in claim 1, wherein, The diameter of the blind hole is larger than the diameter of the perforation.

5. The electronic device housing as described in claim 1, wherein, The depth of the blind hole is between 1 / 4 and 3 / 4 of the thickness of the outer casing.

6. The electronic device housing as described in claim 1, wherein, The opening shape of the blind hole is the same as the opening shape of the perforation.

7. A method of manufacturing an electronic device housing, comprising: providing a housing having an outer side and an inner side; forming a plurality of blind holes on the outer side; and forming at least one through hole on the bottom surface of each blind hole, extending through to the inner side, wherein, The bottom surface is covered with a masking layer, which is either a first color paint layer or a first anodized layer. The outer surface around the opening of the blind hole is covered with an appearance layer, which is either a second color paint layer or a second anodized layer. The grayscale of the masking layer is lower than that of the appearance layer.

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