Cooling device having micro-pin fin

Abstract

A cooling device having micro pin fins includes at least one thermal conductive plate and a plurality of micro pin fins. The thermal conductive plate has a top surface and a bottom surface opposite to each other. The top surface of the thermal conductive plate is connected with the micro pin fins, and the bottom surface of the thermal conductive plate is configured to be in contact with a heat source. The thermal conductive plate is formed to have a small grain area and a plurality of large grain thermal conductive channels located in the small grain area, and each large grain thermal conductive channel is formed from the bottom surface of the thermal conductive plate to the top surface of the thermal conductive plate, and is connected with each corresponding micro pin fin.

Description

[Technical Field]

[0001] This invention relates to a radiator, and more specifically to a radiator with micro-needle columns. [Previous Technology]

[0002] Currently, the market demands for radiators are getting higher and higher, especially for heat dissipation performance, which often makes it impossible for current radiators to meet the requirements. [Summary of the Invention]

[0003] The technical problem to be solved by the present invention is to provide a heat sink with micro-needle columns to address the shortcomings of the prior art.

[0004] An embodiment of the present invention provides a heat sink with microneedle pillars, including at least one heat-conducting plate and a plurality of microneedle pillars; wherein, the at least one heat-conducting plate has a first surface and a second surface facing away from each other, the first surface of the at least one heat-conducting plate is connected to the plurality of microneedle pillars, and the second surface of the at least one heat-conducting plate is used to connect to a heat source; wherein, the at least one heat-conducting plate forms a small grain normal region and a plurality of large grain heat-conducting channels located in the small grain normal region, and each of the large grain heat-conducting channels is formed from the second surface of the at least one heat-conducting plate to the first surface of the at least one heat-conducting plate and is connected to each corresponding microneedle pillar.

[0005] In a preferred embodiment, the cross-sections of the plurality of microneedle columns are at least one of circular, elliptical, square, rhomboid, and teardrop shapes, and the distance between the two farthest endpoints on the cross-section of each microneedle column is <0.5mm.

[0006] In a preferred embodiment, the height of the microneedle column is >3mm.

[0007] In a preferred embodiment, the microneedle column is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0008] In a preferred embodiment, the thickness of the heat-conducting plate is <0.5mm.

[0009] In a preferred embodiment, the heat-conducting plate is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0010] In a preferred embodiment, the large grain heat conduction channel is a non-uniform cross-sectional area channel, and the large grain heat conduction channel has a maximum cross-sectional area portion formed at the second surface of the heat conduction plate.

[0011] In a preferred embodiment, the large grain heat conduction channel is a structure formed by laser melting or resistance welding, which is then solidified.

[0012] In a preferred embodiment, there are at least two or more heat-conducting plates, and the first surface of each heat-conducting plate is connected to the plurality of microneedle columns.

[0013] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0014] The following specific embodiments illustrate the relevant implementation methods disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this invention are only simple schematic illustrations and are not depictions based on actual dimensions, as stated in advance. Furthermore, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, the term "or" used herein should be interpreted as possibly including any combination of any one or more of the associated listed items, depending on the actual situation.

[0015] [First Embodiment]

[0016] Please refer to Figures 1 to 8, which are the first embodiment of the present invention. The embodiment of the present invention provides a heat sink with microneedle columns. The heat sink with microneedle columns provided according to the embodiment of the present invention includes a heat-conducting plate 10 and a plurality of microneedle columns 20.

[0017] In this embodiment, the heat-conducting plate 10 may be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, making the heat-conducting plate 10 a base plate with high thermal conductivity. Furthermore, the thickness of the heat-conducting plate 10 is less than 0.5 mm, making the heat-conducting plate 10 an extremely thin base plate with high thermal conductivity.

[0018] Furthermore, the heat-conducting plate 10 has a first surface 11 and a second surface 12 facing each other. The first surface 11 of the heat-conducting plate 10 is connected to a plurality of microneedle posts 20, and the second surface 12 of the heat-conducting plate 10 is used to contact the heat source 900 (e.g., a power chip).

[0019] In this embodiment, the plurality of microneedle pillars 20 can be integrally connected to the first surface 11 of the heat-conducting plate 10, and the microneedle pillars 20 can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, making the microneedle pillars 20 highly thermally conductive. Furthermore, the cross-section of the microneedle pillars 20 can be circular (as shown in Figure 4), elliptical (as shown in Figure 5), square (as shown in Figure 6), rhomboid (as shown in Figure 7), or teardrop-shaped (as shown in Figure 8). Regardless of the shape of the cross-section of the microneedle pillars 20, as shown in Figures 5 and 7, the distance between the two farthest endpoints A and B on the cross-section of the microneedle pillars 20 needs to be less than (<) 0.5 mm to meet the microneedle requirements. In addition, the height of the microneedle pillars 20 can be greater than (>) 3 mm, up to a maximum of 6 mm, making the microneedle pillars 20 tall needle-shaped heat dissipation pillars.

[0020] It is worth mentioning that, in order to increase the thermal conductivity of the heat-conducting plate 10, the heat-conducting plate 10 of this embodiment has a small-grain normal region 101 and a plurality of large-grain heat-conducting channels 102 located in the small-grain normal region 101. That is, the average size of the grains 1020 of the large-grain heat-conducting channels 102 (as shown in Figure 3) is much larger than the average size of the grains 1010 of the small-grain normal region 101 (as shown in Figure 2). Furthermore, each large-grain heat-conducting channel 102 is formed from the second surface 12 of the heat-conducting plate 10 to the first surface 11 of the heat-conducting plate 10 and is connected to each corresponding microneedle column 20. Thus, a small grain normal area 101 and a plurality of large grain heat conduction channels 102 are formed through the heat conduction plate 10. Each large grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 and is connected to each corresponding microneedle column 20. This allows the heat source 900 located on the second surface 12 of the heat conduction plate 10 to conduct high heat to the microneedle column 20 located on the first surface 11 of the heat conduction plate 10 through the large grain heat conduction channel 102, thereby dissipating the high heat.

[0021] Furthermore, the large grain heat conduction channel 102 in this embodiment is a non-uniform cross-sectional area channel, and the large grain heat conduction channel 102 has a maximum cross-sectional area portion 1021 formed at the position of the second surface 12 of the heat conduction plate 10. That is, compared with the minimum cross-sectional area portion 1022 formed at the position of the first surface 11 of the heat conduction plate 10, the large grain heat conduction channel 102 has the largest contact area with the heat source 900 at the position of the second surface 12 of the heat conduction plate 10, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can better conduct high heat through the large grain heat conduction channel 102 to the micro needle column 20 located on the first surface 11 of the heat conduction plate 10, thereby dissipating the high heat.

[0022] Furthermore, in this embodiment, the large grain heat conduction channel 102 and the small grain normal area 101 of the heat conduction plate 10 are formed of the same material, thus having material continuity. Moreover, there is no heterogeneous material interface between the large grain heat conduction channel 102 and the small grain normal area 101 of the heat conduction plate 10, so no interface thermal resistance will be generated and the overall thermal conductivity will be affected.

[0023] Furthermore, in order to better form large-grain heat-conducting channels 102 in the heat-conducting plate 10, the large-grain heat-conducting channels 102 in this embodiment can be a structure formed by laser processing. More specifically, the large-grain heat-conducting channels 102 in this embodiment are formed by laser melting and then solidification, or they can be described as a solid channel structure formed by laser melting and then solidification. Alternatively, the large-grain heat-conducting channels 102 in this embodiment can also be a solid channel structure formed by resistance welding and then solidification.

[0024] [Second Embodiment]

[0025] Please refer to Figure 9, which is the second embodiment of the present invention. This embodiment is largely the same as the first embodiment, and the differences are explained below.

[0026] The heat sink with microneedle pillars provided in this embodiment includes two heat-conducting plates 10. Furthermore, the first surface 11 of each heat-conducting plate 10 is connected to a plurality of microneedle pillars 20. More specifically, the first surface 11 of one heat-conducting plate 10 is connected to one end of the plurality of microneedle pillars 20, and the first surface 11 of the other heat-conducting plate 10 is connected to the other end of the plurality of microneedle pillars 20. Additionally, the second surface 12 of one heat-conducting plate 10 is connected to a heat source 900, and the second surface 12 of the other heat-conducting plate 10 is connected to another heat source 900, so that the two heat sources 900 can respectively conduct high heat to the microneedle pillars 20 through the two heat-conducting plates 10, thereby dissipating the high heat.

[0027] [Third Embodiment]

[0028] Please refer to Figure 10, which is the third embodiment of the present invention. This embodiment is largely the same as the second embodiment, and the differences are explained below.

[0029] The heat sink with microneedle pillars provided in this embodiment includes two heat-conducting plates 10. The first surface 11 of one heat-conducting plate 10 is connected to one end of a plurality of microneedle pillars 20, and the first surface 11 of the other heat-conducting plate 10 is connected to the other end of the plurality of microneedle pillars 20. Furthermore, the second surface 12 of one heat-conducting plate 10 is connected to a heat source 900, while the second surface 12 of the other heat-conducting plate 10 is not connected to any heat source, in order to simply improve heat dissipation capacity.

[0030] [Fourth Embodiment]

[0031] Please refer to Figure 11, which is the fourth embodiment of the present invention. This embodiment is largely the same as the second embodiment, and the differences are explained below.

[0032] The heat sink with microneedle columns provided in this embodiment includes three heat-conducting plates 10. The first surface 11 of one heat-conducting plate 10 is connected to one end (lower end) of a plurality of microneedle columns 20, and the first surface 11 of the other two heat-conducting plates 10 is connected to the other end (upper end) of the plurality of microneedle columns 20. Furthermore, the second surface 12 of one heat-conducting plate 10 is connected to one heat source 900, and the second surface 12 of the other two heat-conducting plates 10 are respectively connected to two other heat sources 900. This allows for effective simultaneous heat conduction to the three heat sources 900, enabling the three heat sources 900 to conduct high heat to the microneedle columns 20 through the three heat-conducting plates 10, thereby dissipating the high heat.

[0033] In summary, the heat sink with microneedle pillars provided by the present invention includes a heat-conducting plate 10 and a plurality of microneedle pillars 20. The heat-conducting plate 10 has a first surface 11 and a second surface 12 facing each other. The first surface 11 of the heat-conducting plate 10 is connected to the plurality of microneedle pillars 20, and the second surface 12 of the heat-conducting plate 10 is used to connect to a heat source 900. The heat-conducting plate 10 forms a small grain normal region 101 and a plurality of large grain heat-conducting channels 102 located in the small grain normal region 101, and each large grain heat-conducting channel 102 is formed from the second surface 12 of the heat-conducting plate 10 to the first surface 11 of the heat-conducting plate 10 and is connected to each corresponding microneedle pillar 20. Thus, a small grain normal area 101 and a plurality of large grain heat conduction channels 102 are formed through the heat conduction plate 10. Each large grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 and is connected to each corresponding microneedle column 20. This allows the heat source 900 located on the second surface 12 of the heat conduction plate 10 to conduct high heat to the microneedle column 20 located on the first surface 11 of the heat conduction plate 10 through the large grain heat conduction channel 102, thereby dissipating the high heat.

[0034] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0035] Figure 1 is a side view of a first embodiment of a heat sink with micro-needle columns.

[0036] Figure 2 is an enlarged schematic diagram of part II in Figure 1.

[0037] Figure 3 is an enlarged schematic diagram of part III in Figure 1.

[0038] Figure 4 is a schematic diagram of an embodiment of the microneedle column.

[0039] Figure 5 is a schematic diagram of an embodiment of the microneedle column.

[0040] Figure 6 is a schematic diagram of an embodiment of the microneedle column.

[0041] Figure 7 is a schematic diagram of an embodiment of the microneedle column.

[0042] Figure 8 is a schematic diagram of an embodiment of the microneedle column.

[0043] Figure 9 is a side view of a second embodiment of a heat sink with micro-needle columns.

[0044] Figure 10 is a side view of a third embodiment of a heat sink with micro-needle columns.

[0045] Figure 11 is a side view of a fourth embodiment of a heat sink with micro-needle columns.

Claims

1. A heat sink with microneedle columns, comprising at least one heat-conducting plate and a plurality of microneedle columns; wherein, The at least one heat-conducting plate has a first surface and a second surface facing away from each other. The first surface of the at least one heat-conducting plate is connected to the plurality of microneedle pillars, and the second surface of the at least one heat-conducting plate is used to connect to a heat source. The at least one heat-conducting plate forms a small grain normal region and a plurality of large grain heat-conducting channels located in the small grain normal region. Each of the large grain heat-conducting channels is formed from the second surface of the at least one heat-conducting plate to the first surface of the at least one heat-conducting plate and is connected to each corresponding microneedle pillar.

2. The heat sink with microneedle columns as described in claim 1, wherein, The cross-sections of the plurality of microneedles are at least one of circular, elliptical, square, rhomboid, and teardrop shapes, and the distance between the two farthest endpoints on the cross-section of each microneedle is <0.5 mm.

3. The heat sink with microneedle columns as described in claim 1, wherein, The height of the microneedle column is >3mm.

4. The heat sink with microneedle columns as described in claim 1, wherein, The microneedle column is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

5. The heat sink with microneedle columns as described in claim 1, wherein, The thickness of the heat-conducting plate is <0.5mm.

6. The heat sink with microneedle columns as described in claim 1, wherein, The heat-conducting plate is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

7. The heat sink with microneedle columns as described in claim 1, wherein, The large-grain heat conduction channel is a non-uniform cross-sectional area channel, and the large-grain heat conduction channel has a maximum cross-sectional area portion formed on the second surface of the heat conduction plate.

8. The heat sink with microneedle columns as described in claim 1, wherein, The large-grain heat-conducting channel is a structure formed by laser melting or resistance welding, which is then solidified.

9. The heat sink with microneedle columns as described in claim 1, wherein, There are at least two heat-conducting plates, and the first surface of each heat-conducting plate is connected to the plurality of microneedle columns.

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