Devices and systems for immersion cooling

Abstract

In accordance with some embodiments of the present disclosure, a device includes a first printed circuit board (PCB) including a first major plane and a connector configured to connect to a slot, a second PCB including a second major plane, and a rigid-flex circuit coupling the first PCB to the second PCB at respective distal ends of the PCBs. The device further includes at least one interconnection to communicate signals between the first PCB and the second PCB. The rigid-flex circuit is foldable to orient the device into one of a first form factor or a second form factor. In the first form factor, the first major plane and the second major plane are coplanar, whereas in the second form factor, the first major plane and the second major plane are parallel. The device is configured to be unenclosed such that the device is capable of being immersion cooled.

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