Thermal management for an electrical component

TW202636728APending Publication Date: 2026-09-01TE CONNECTIVITY SOLUTIONS GMBH
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Patent Information

Application Number
TW115104920
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-12
Filing Date
2026-02-09
Publication Date
2026-09-01

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Abstract

to dissipate heat from the electrical component. The thermal bridge extends through the cold plate body with the upper thermal interface exposed in the fluid cavity for interfacing with the coolant.
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