Structure containing semiconductor memory device and method for manufacturing semiconductor memory device

TW202636752APending Publication Date: 2026-09-01SHIN ETSU HANDOTAI CO LTD
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Patent Information

Application Number
TW114148612
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-07
Filing Date
2025-12-11
Publication Date
2026-09-01

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Abstract

This invention relates to a structure containing a semiconductor memory device and a method for manufacturing the semiconductor memory device. The structure comprising: a silicon substrate; an oxygen delta-doped layer on the silicon substrate; a silicon epitaxial layer on the oxygen delta-doped layer; and a semiconductor memory device formed on the silicon epitaxial layer. The method for manufacturing the semiconductor memory device involves irradiating the silicon substrate with a laser and then peeling off the silicon substrate from the oxygen delta-doped layer. This provides a structure containing a semiconductor memory device and a method for manufacturing the semiconductor memory device, which can be easily thin-film sizing. none
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