Structure containing semiconductor memory device and method for manufacturing semiconductor memory device
TW202636752APending Publication Date: 2026-09-01SHIN ETSU HANDOTAI CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114148612
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-07
- Filing Date
- 2025-12-11
- Publication Date
- 2026-09-01
Smart Images

Figure 00000000_0000_ABST
Abstract
This invention relates to a structure containing a semiconductor memory device and a method for manufacturing the semiconductor memory device. The structure comprising: a silicon substrate; an oxygen delta-doped layer on the silicon substrate; a silicon epitaxial layer on the oxygen delta-doped layer; and a semiconductor memory device formed on the silicon epitaxial layer. The method for manufacturing the semiconductor memory device involves irradiating the silicon substrate with a laser and then peeling off the silicon substrate from the oxygen delta-doped layer. This provides a structure containing a semiconductor memory device and a method for manufacturing the semiconductor memory device, which can be easily thin-film sizing. none
Need to check novelty before this filing date? Find Prior Art