Semiconductor device with supporting layers and method for fabricating the same

Abstract

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including at least four active portions, and at least two supporting portions connecting the at least four active portions. Two of the active portions are arranged along a first direction and separated by an opening. The other two of the active portions are arranged along a second direction perpendicular to the first direction, separated by the opening, and with the two of the active portions interposed therebetween. The other two of the active portions arranged along the second direction and the two of the active portions arranged along the first direction are separated by a plurality of recesses. The supporting portions are arranged along the second direction, separated by the opening, and respectively connecting to three of the active portions.

Images