Semiconductor devices and methods for manufacturing the same

Abstract

A semiconductor device includes a first semiconductor die including a plurality of first transistors, wherein the plurality of first transistors each have a first gate feature; and a second semiconductor die coupled to the first semiconductor die through a plurality of bump structures, and including a plurality of second transistors, wherein the plurality of second transistors each have a second gate feature smaller than the first gate feature. At least a subset of the plurality of first transistors, operatively serve as one or more power switches, are configured to receive a first supply voltage and electrically couple the first supply voltage to a subset of the plurality of second transistors for a period of time.

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