Electronic module and manufacturing method of electronic module

Abstract

The main objective of this technology is to provide a method that can reduce the potential for poor electrical connection between electronic components within an electronic module and external power supply electrodes due to temperature variations (TC cycles) generated during the manufacturing of electronic modules. Through in-depth research, the inventors discovered that by connecting the wires that electrically connect the electronic components mounted on the substrate to the external power supply electrodes through ribs that support the cover opposite the electronic components, the stress applied to the connection portion (neck) between the wires and the electronic components during temperature variations generated during the manufacturing of the electronic module can be reduced.

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