LED device and method for manufacturing thereof, LED light source comprising the same

Abstract

This invention relates to a method for manufacturing LED components. According to this method, LED components with smaller wafer sizes and greater quantity can be obtained from a single wafer, and the dead volume caused by surface defects generated during the dry etching process and dangling bonds generated during the wet etching process is minimized. This results in each LED component exhibiting high-efficiency physical properties, which can be widely used in the manufacture of light sources with high resolution and high brightness characteristics.

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