Semiconductor structure

Abstract

The invention provides a semiconductor structure, which includes a light-transmitting substrate, an adhesive layer and a semiconductor element. The adhesive layer arranged above one of the light-transmitting substrate. The semiconductor element arranged above one of the adhesive layers. The semiconductor element includes a semiconductor unit, an insulating layer and an electrode layer. The front substrate is then transferred to the top of the light-transmitting substrate and the adhesive layer, and the insulating layer etched to form the flat portion on the top outer edge of the semiconductor unit to improve the structural consistency of the semiconductor structure.