Semiconductor structure
TW202636829AInactive Publication Date: 2026-09-01RAYLEIGH VISION INTELLIGENCE CO LTD
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Patent Information
- Application Number
- TW114106333
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-09-01
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
The invention provides a semiconductor structure in which a semiconductor element is disposed above a transparent substrate. The semiconductor element includes a recessed portion and a receiving portion disposed above a semiconductor unit. The receiving portion disposed at an outer edge of the recessed portion. An insulating layer covers an outside of the semiconductor unit, and the insulating layer provides a flat surface on an outer side of the receiving portion. An electrode layer electrically connected to the semiconductor unit and the light-transmitting substrate. The etched portion of the insulating layer forms the flat surface at an outer edge of the semiconductor unit, and then etch the surface of the semiconductor unit to form the recessed portion and the receiving portion on the semiconductor unit. The receiving portion used to stably transfer the semiconductor structure in a line contact manner when transferring the semiconductor structure.
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