Joining device and joining method

Abstract

This invention provides a technique that reduces the number of detection units comprised of a light source, an optical system, and a camera. The bonding apparatus of this invention aligns the die and the substrate based on the relative positions of a first mark on the die and a second mark on the substrate, thereby bonding the die to the substrate. The bonding apparatus includes a first detection unit that detects at least one of the first mark and the second mark. The first detection unit includes: a light source for generating light; an optical system that forms an optical path through which the light generated by the light source illuminates the die or the substrate; and a camera that receives reflected light from the light illuminated by the optical system. The first detection unit further includes: a switching mechanism that switches the light illuminated by the optical system onto the die or the substrate between a first light and a second light having a different wavelength than the first light.

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