Epitaxial growth method from nucleation layer

TW202636857APending Publication Date: 2026-09-01SOITEC SA
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Patent Information

Application Number
TW114151125
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-12-24
Publication Date
2026-09-01

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Abstract

This invention relates to an epitaxial growth method starting from a nucleation layer. A stack (1) is provided, comprising a support (100) including a substrate (10) based on a first semiconductor material, an insulating layer (20), and a nucleation layer (30). The support (100) has a portion not covered by the nucleation layer (30), referred to as an exposed portion (150). The exposed portion has an exposed upper surface (151) formed by the insulating layer (20) at this stage. The support is then modified such that the upper surface of the exposed portion (150) is at least partially composed of a layer based on a third semiconductor material, referred to as a semiconductor layer (10). Epitaxial growth is then performed starting from the nucleation layer (30).
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