Zonal window control to improve wafer film thickness uniformity

TW202636859APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114139237
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-13
Filing Date
2025-10-13
Publication Date
2026-09-01

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Abstract

A window for use in a processing chamber applicable for use in semiconductor manufacturing, including a first zone disposed between a first radius and a second radius including a first transmissivity and a second zone disposed between the second radius and a third radius including a second transmissivity.
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