Etching of molybdenum
TW202636871APending Publication Date: 2026-09-01LAM RES CORP
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Patent Information
- Application Number
- TW114140341
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-21
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-01
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Figure TWG2TA001074406_001 
Figure TWG2TA001074406_002 
Figure TWG2TA001074406_003
Abstract
Methods of etching molybdenum involve optionally oxidizing a portion of deposited molybdenum and exposing the substrate to an etchant. The exposure removes oxygen and halogen species from the molybdenum film, resulting in etched molybdenum. The methods reduce line-to-line (LtL) variation, roughness, molybdenum faceting, and line bending. The methods may be used for logic and memory applications.
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