Substrate processing system

TW202636874APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115120442
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2018-04-27
Filing Date
2019-03-04
Publication Date
2026-09-01

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Abstract

The present invention provides a substrate processing system for processing a substrate, the system having a modified layer formation device that forms a modified layer in the interior of the substrate along the boundary between a peripheral section that is to be removed and a center section, and a periphery removal device that removes the peripheral section using the modified layer as a guide.
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