Processing apparatus and wafer manufacturing method

Abstract

[Problem] To provide a processing apparatus that improves productivity and saves space. [Solution] The processing apparatus 1A of the present invention includes: a first holding unit 2A for holding a workpiece; a first moving part for moving the first holding unit 2A in a first direction D1 intersecting the vertical direction; a second holding unit 4A disposed adjacent to the first holding unit and holding the workpiece; a second moving part for moving the second holding unit 4A in the first direction D1; a first processing unit 10A for processing the workpiece held in the first holding unit 2A and the second holding unit 4A; and a first lifting part 7A for moving the first processing unit 10A in the vertical direction to a first processing area R1 for processing the workpiece held in the first holding unit 2A and the second holding unit 4A, wherein the first holding unit 2A and the second holding unit 4A are configured to move independently in the first direction D1 and are movable to the first processing area R1.

Images