Processing chambers for cleaning and inspection of bonded substrates and related methods

Abstract

An embodiment of a processing chamber includes an enclosure defining a processing volume, a substrate support positioned in the processing volume to support a substrate and to rotate the substrate about a central axis. In addition, the processing chamber includes a cleaning nozzle to direct a cleaning fluid onto a surface of the substrate within the processing volume. Further, the processing chamber includes an acoustic inspection assembly positioned in the processing volume, the acoustic inspection assembly including a fluid nozzle to direct a stream of fluid onto the surface of the substrate and an acoustic probe coupled to the fluid nozzle such that the acoustic probe is configured to direct an acoustic wave through the stream of fluid to detect a defect in the substrate

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