Substrate processing method and substrate processing apparatus

Abstract

The substrate processing method of the present invention includes the following steps: moving a first substrate into a chamber; performing a main treatment on the first substrate by supplying a processing liquid at a temperature different from room temperature to the substrate through a chemical nozzle; moving the first substrate out of the chamber and moving a second substrate into the chamber; starting to spray the processing liquid after a certain time has elapsed since the stopping of the spraying of the processing liquid, and performing the main treatment on the second substrate; moving the second substrate out of the chamber and moving a third substrate into the chamber; and starting to spray the processing liquid after a certain time has elapsed since the stopping of the spraying of the processing liquid, and performing the main treatment on the third substrate.

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