Substrate processing method and substrate processing apparatus

Abstract

This disclosure provides a substrate processing method and apparatus that, when spraying a first processing liquid and a second processing liquid onto a substrate, prevents processing traces of the first processing liquid from forming on areas of the substrate that are not the target of the first processing liquid. In the substrate processing method, a processing liquid ejection nozzle ejects the first processing liquid onto the outer periphery of the substrate at a first ejection position. The nozzle stops ejecting the first processing liquid at the first ejection position. After stopping ejecting the first processing liquid, the nozzle remains stationary at the first ejection position for a predetermined time. After the predetermined time, the second processing liquid is ejected onto the outer periphery of the substrate at a second ejection position located closer to the center of the substrate than the first ejection position.

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