Semiconductor cleaning apparatus and pipeline assembly thereof

TW202636884APending Publication Date: 2026-09-01BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
TW115105828
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-24
Filing Date
2026-02-12
Publication Date
2026-09-01

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Abstract

This application discloses a semiconductor cleaning apparatus and a pipeline assembly thereof, belonging to the technical field of semiconductor cleaning. The pipeline assembly is designed to be placed inside a cleaning tank of the semiconductor cleaning apparatus. The pipeline assembly includes a gas injection pipeline assembly, which includes multiple gas injection pipes arranged at intervals. Each gas injection pipe is used to separately introduce an oxygen-expelling gas into the cleaning tank, and along the extension direction of each gas injection pipe, multiple gas outlets are arranged at intervals on each pipe. The semiconductor cleaning apparatus includes a cleaning tank and the aforementioned pipeline assembly, with the pipeline assembly being insertable into the cleaning tank. In this way, by introducing an oxygen-expelling gas into the cleaning tank through the gas injection pipes, the oxygen dissolution equilibrium between the gas and liquid phases can be altered, thereby preventing insufficient contact between the cleaning solution and the wafer caused by excessive oxygen content, and improving both the cleaning effectiveness and process performance for the wafer.
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