Apparatus and method for treating substrate

TW202636886APending Publication Date: 2026-09-01ZEUS
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Patent Information

Application Number
TW115106797
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-27
Filing Date
2026-02-25
Publication Date
2026-09-01

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Abstract

A substrate processing apparatus and a substrate processing method are disclosed. The disclosed substrate processing apparatus includes: a substrate support portion that supports a substrate; an ejection portion that ejects a liquid medicine onto the substrate; and a cup having a collecting wall portion, a groove portion, and a drain outlet, wherein the collecting wall portion surrounds the substrate support portion to collect the liquid medicine discharged from the substrate support portion after being ejected onto the substrate, the groove portion collects the liquid medicine falling along the collecting wall portion, and the drain outlet is provided on one side of the groove portion to allow the liquid medicine to be discharged from the groove portion; wherein the bottom of the groove portion includes: a first bottom portion; and a second bottom portion that forms a height difference with the first bottom portion and is recessed deeper below the first bottom portion.
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