Apparatus and method for treating substrate
TW202636886APending Publication Date: 2026-09-01ZEUS
0 Cites 0 Cited by
Patent Information
- Application Number
- TW115106797
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-27
- Filing Date
- 2026-02-25
- Publication Date
- 2026-09-01
Smart Images

Figure 00000000_0000_ABST
Abstract
A substrate processing apparatus and a substrate processing method are disclosed. The disclosed substrate processing apparatus includes: a substrate support portion that supports a substrate; an ejection portion that ejects a liquid medicine onto the substrate; and a cup having a collecting wall portion, a groove portion, and a drain outlet, wherein the collecting wall portion surrounds the substrate support portion to collect the liquid medicine discharged from the substrate support portion after being ejected onto the substrate, the groove portion collects the liquid medicine falling along the collecting wall portion, and the drain outlet is provided on one side of the groove portion to allow the liquid medicine to be discharged from the groove portion; wherein the bottom of the groove portion includes: a first bottom portion; and a second bottom portion that forms a height difference with the first bottom portion and is recessed deeper below the first bottom portion.
Need to check novelty before this filing date? Find Prior Art