Attaching apparatus of heat dissipation materials, feeding method of heat dissipation materials, and attaching method of heat dissipation materials

Abstract

An attaching apparatus of heat dissipation materials includes a platform, a first feeding module, a second feeding module, a first deployment module, and a second deployment module. The platform includes a first feeding region and a second feeding region. The first feeding region and the second feeding region respectively have a first concave and a second concave recessed into the platform. The first feeding module is detachably disposed in the first concave or the second concave, and configured to feed first heat dissipation materials. The second feeding module is detachably disposed in the first concave or the second concave, and configured to feed second heat dissipation materials. The first feeding module and the second module are different, and sizes of the first heat dissipation materials and the second heat dissipation materials are different. The first deployment module is movably disposed on the platform and configured to suck the first heat dissipation materials or the second heat dissipation materials from the first feeding region, and deliver and attach the first heat dissipation materials or the second heat dissipation materials. The second deployment module is movably disposed on the platform and configured to suck the first heat dissipation materials or the second heat dissipation materials from the second feeding region, and deliver and attach the first heat dissipation materials or the second heat dissipation materials.

Description

[Technical Field]

[0001] This disclosure relates to a semiconductor packaging technology, and more particularly to a heat sink attachment machine, a heat sink feeding method, and a heat sink attachment method. [Previous Technology]

[0002] In the semiconductor packaging field, heat sink attaching machines are typically equipped with a single type of feeding module. Therefore, during operation, the heat sink attaching machine can only perform the heat sink attaching process for a single product size.

[0003] However, the heat dissipation material application process requires the application of materials of different sizes, and conventional heat dissipation material application equipment cannot continuously perform heat dissipation material application operations of different sizes. When the product needs to be continuously applied with heat dissipation materials of different sizes, two or more machines with different feeding modules are required to complete the application of heat dissipation materials of different sizes.

[0004] Furthermore, under this material supply mode, it is necessary to wait for the entire batch of products to complete the application of the first size of heat sink material on the first machine before using the second machine to apply the second size of heat sink material. The above method is not only not streamlined, but also consumes extra waiting time, and requires a large number of machines and space. [Summary of the Invention]

[0005] Therefore, one of the objectives of this disclosure is to provide a heat dissipation material application machine, a heat dissipation material feeding method, and a heat dissipation material application method, which can meet the application needs of various heat dissipation materials in the heat dissipation material application process. Thus, the operation process can be simplified and waiting time can be saved.

[0006] In accordance with the above-mentioned objectives of this disclosure, a heat dissipation material attachment machine is provided, comprising a platform, at least one first feeding module, at least one second feeding module, a first substrate module, and a second substrate module. The platform includes a first feeding area and a second feeding area. The first feeding area and the second feeding area each have a first receiving groove and a second receiving groove recessed into the platform. At least one first feeding module is detachably disposed in the first receiving groove or the second receiving groove and configured to supply a plurality of first heat dissipation materials. At least one second feeding module is detachably disposed in the first receiving groove or the second receiving groove and configured to supply a plurality of second heat dissipation materials. The first feeding module is different from the second feeding module, and the size of the first heat dissipation material is different from the size of the second heat dissipation material. The first substrate module is movable on the platform along the X-axis, Y-axis, and Z-axis. The first substrate module is configured to pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the first feeding area. The second implantation module can be movably mounted on the platform along the X, Y, and Z axes. The second implantation module is configured to pick up, transport, and attach the first or second heat dissipation material from the second feeding area.

[0007] According to one embodiment of the present disclosure, the first feeding module is a pallet feeding module and the second feeding module is a feeder feeding module.

[0008] According to one embodiment of this disclosure, the pallet feeding module includes a pallet and two support seats. The pallet is configured to support the first heat dissipation material. The two support seats are respectively disposed on opposite sides of the first receiving groove or opposite sides of the second receiving groove to support and fix the pallet. The feeder feeding module includes a transfer module, at least one feeder, and at least one discharge reel. The transfer module is disposed in the first receiving groove or the second receiving groove. The feeder is disposed on the transfer module. The discharge reel is disposed on the feeder.

[0009] According to one embodiment of the present disclosure, the number of the above-mentioned at least one feeder and at least one discharge belt reel are both two, and the feeder is respectively corresponding to the discharge belt reel.

[0010] According to one embodiment of this disclosure, the first of the above-mentioned discharge reel is configured to load a second heat dissipation material. The second of the discharge reel is configured to load a plurality of third heat dissipation materials, the dimensions of which are different from the dimensions of the second heat dissipation material.

[0011] According to one embodiment of this disclosure, the platform further includes a first working area and a second working area. The heat sink attaching machine further includes a transport device extending into the first and second working areas, and the transport device is configured to transport a plurality of substrates in one direction. The first substrate module is configured to attach a first heat sink or a second heat sink to the substrate in the first working area, and the second substrate module is configured to attach a first heat sink or a second heat sink to the substrate in the second working area.

[0012] In accordance with the above-mentioned objectives of this disclosure, another heat sink attachment machine is proposed, comprising a platform, at least one first feeding module, at least one second feeding module, a first substrate module, and a second substrate module. The platform includes a first feeding area and a second feeding area. The first feeding area and the second feeding area each have a first receiving groove and a second receiving groove recessed into the platform. The first feeding module is detachably disposed in the first receiving groove or the second receiving groove and is configured to supply a plurality of first heat sinks. The second feeding module is detachably disposed in the first receiving groove or the second receiving groove and is configured to supply a plurality of second heat sinks. The first feeding module may be the same as or different from the second feeding module, and the dimensions of the first heat sinks are correspondingly the same as or different from those of the second heat sinks. The first substrate module is movable on the platform along the X-axis, Y-axis, and Z-axis. The first substrate module is configured to pick up, transport, and attach the first heat sink or the second heat sink from the first feeding area. The second implantation module can be movably mounted on the platform along the X, Y, and Z axes. The second implantation module is configured to pick up, transport, and attach the first or second heat dissipation material from the second feeding area.

[0013] According to one embodiment of the present disclosure, the first feeding module is a tray feeding module and the second feeding membrane group is a feeder feeding module.

[0014] According to one embodiment of this disclosure, the pallet feeding module includes a pallet and two support seats. The pallet is configured to support the first heat dissipation material. The two support seats are respectively disposed on opposite sides of the first receiving groove or opposite sides of the second receiving groove to support and fix the pallet. The feeder feeding module includes a transfer module, at least one feeder, and at least one discharge reel. The transfer module is disposed in the first receiving groove or the second receiving groove. The feeder is disposed on the transfer module. The discharge reel is disposed on the feeder.

[0015] In accordance with the above-mentioned objective of this disclosure, a method for supplying heat dissipation material is proposed. In this method, a first supply module and a second supply module are respectively disposed in the first supply area and the second supply area of ​​the platform of the heat dissipation material attaching machine, wherein the first supply module and the second supply module are different. Then, a feeding operation is performed to simultaneously supply several first heat dissipation materials to the first substrate module of the heat dissipation material attaching machine and several second heat dissipation materials to the second substrate module of the heat dissipation material attaching machine, wherein the size of the first heat dissipation material is different from the size of the second heat dissipation material.

[0016] According to one embodiment of the present disclosure, the first feeding module is a tray feeding module and the second feeding membrane group is a feeder feeding module.

[0017] According to one embodiment of this disclosure, the above-mentioned feeder module includes a transfer module, two feeders, and two output tape reels. The transfer module is disposed in a platform. The two feeders are separately disposed on the transfer module. The two output tape reels are respectively disposed on the feeders. The first output tape reel carries a second heat sink, and the second output tape reel carries several third heat sinks. The dimensions of the third heat sinks are different from the dimensions of the first heat sinks and the second heat sinks. The feeding operation of the heat sink feeding method further includes simultaneously supplying the third heat sinks using the second feeding module.

[0018] In accordance with the above-mentioned objectives of this disclosure, a method for attaching heat dissipation materials is proposed. In this method, a feeding operation is performed on the platform of a heat dissipation material attaching machine to simultaneously supply several first heat dissipation materials using a first feeding module and several second heat dissipation materials using a second feeding module. The size of the first heat dissipation materials is different from the size of the second heat dissipation materials, and the platform includes a first working area and a second working area. Next, a material picking operation is performed to pick up the first heat dissipation materials from the first feeding module and the second heat dissipation materials from the second feeding module using the first and second implantation modules of the heat dissipation material attaching machine, respectively. Then, an attaching operation is performed to attach the first heat dissipation materials in the first working area and the second heat dissipation materials in the second working area using the first and second implantation modules, respectively.

[0019] According to one embodiment of the present disclosure, the above-mentioned bonding operation further includes using a carrier device of a heat dissipation material bonding machine to transport several substrates to a first working area, using a first bonding module to bond a first heat dissipation material to these substrates respectively, using a carrier device to transport the substrates from the first working area to a second working area, and using a second bonding module to bond a second heat dissipation material to the substrates respectively.

[0020] According to one embodiment of the present disclosure, the above-mentioned bonding operation further includes using the transport device of the heat dissipation material bonding machine to transport a plurality of first substrates and a plurality of second substrates to a first working area and a second working area respectively, and using a first bonding module and a second bonding module to bond a first heat dissipation material to the first substrate and a second heat dissipation material to the second substrate respectively.

[0021] According to one embodiment of this disclosure, the first feeding module is a tray feeding module, and the second feeding film group is a feeder feeding module. The feeder feeding module includes two feeders and two output reel rollers respectively disposed on the feeders. The first output reel roller carries the second heat sink, and the second output reel roller carries several third heat sinks. The size of the third heat sink is different from the size of the first heat sink and the size of the second heat sink. The bonding operation further includes using the first and second bonding heads of the second bonding module to pick up the second heat sink and the third heat sink respectively, and using the first and second bonding heads to bond the second heat sink and the third heat sink to the substrate on the second working area.

Implementation Method

[0022] The embodiments of this disclosure are discussed in detail below. However, it will be understood that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific situations. The embodiments discussed and disclosed are for illustrative purposes only and are not intended to limit the scope of this disclosure. All embodiments of this disclosure disclose a variety of different features, but these features may be implemented individually or in combination as needed.

[0023] In addition, the terms "first", "second", etc. used in this document do not specifically refer to order or sequence, but are only used to distinguish elements or operations described with the same technical terms.

[0024] The spatial relationship between the two elements described in this disclosure applies not only to the orientation shown in the diagram, but also to orientations not shown in the diagram, such as inverted orientations. Furthermore, the terms "connection," "electrical connection," or similar expressions used in this disclosure to refer to the two components are not limited to a direct or electrical connection, but may also include indirect or electrical connections as needed.

[0025] Please refer to Figures 1 and 2, which are respectively top view and perspective view of the configuration of a heat dissipation material application machine 100 according to the first embodiment of this disclosure. The application machine 100 mainly includes a platform 200, at least one first feeding module 300, at least one second feeding module 400, a first substrate module 500, and a second substrate module 600.

[0026] The platform 200 may be a box structure, which can be used to support at least one first feeding module 300, at least one second feeding module 400, a first implantation module 500, and a second implantation module 600. The platform 200 includes a first feeding area 210 and a second feeding area 220. The first feeding area 210 and the second feeding area 220 are separate from each other and may be arranged, for example, parallel to one side of the platform 200. As shown in FIG2, the first feeding area 210 and the second feeding area 220 respectively have a first receiving groove 212 and a second receiving groove 222. The first receiving groove 212 and the second receiving groove 222 are both recessed into the platform 200 and have recessed spaces to accommodate the first feeding module 300 or the second feeding module 400. That is, the first receiving slot 212 can accommodate the first feeding module 300 or the second feeding module 400, and the second receiving slot 222 can accommodate the first feeding module 300 or the second feeding module 400.

[0027] In some embodiments, the platform 200 further includes a first working area 230 and a second working area 240. The first working area 230 and the second working area 240 may be, for example, elongated. The first working area 230 and the second working area 240 may be adjacent to each other. In some embodiments, the first working area 230 and the second working area 240 are disposed adjacent to the center of the platform 200 and span the platform 200 parallel to the direction X, and are perpendicular to the first feeding area 210 and the second feeding area 220. The first working area 230 and the second working area 240 may be disposed on the platform 200 in different orientations, which is not limited thereto in this disclosure.

[0028] The first feeding module 300 is detachably disposed in the first receiving groove 212 or the second receiving groove 222 to supply the first heat dissipation material. In this embodiment, the first feeding module 300 is a tray feeding module and includes a tray 310 and two support bases 320. The tray 310 may have a grid structure arranged in an array and can support several first heat dissipation materials. The two support bases 320 are elongated. In the embodiment shown in FIG2, the first feeding module 300 is disposed in the first receiving groove 212, and the two support bases 320 are respectively arranged parallel to each other on opposite sides of the first receiving groove 212 to support and fix the tray 310. Specifically, the tray 310 is disposed and fixed on the two support bases 320. The first feeding module 300 is fixed in the first receiving groove 212 through the two support bases 320.

[0029] The second feeding module 400 is detachably disposed in the first receiving groove 212 or the second receiving groove 222 to supply the second heat dissipation material. In this embodiment, the second feeding module 400 is disposed in the second receiving groove 222. The second feeding module 400 is a different feeding module from the first feeding module 300, and the size of the second heat dissipation material is different from the size of the first heat dissipation material. The size of the first heat dissipation material may be greater than, equal to, or smaller than the size of the second heat dissipation material. In some embodiments, the second feeding module 400 is a feeder feeding module and includes a transfer module 410, at least one feeder 420, and at least one discharge reel 430. In the embodiment shown in FIG. 2, the transfer module 410 is disposed in the second receiving groove 222. The feeder 420 is disposed on the transfer module 410. The discharge belt reel 430 is mounted on the feeder 420, and the number of discharge belt reels 430 can correspond to the number of feeders 420.

[0030] Generally speaking, compared to a feeder module, a tray module can support larger heat sinks. Therefore, in the embodiment where the first feeding module 300 is a tray module and the second feeding module 400 is a feeder module, the size of the first heat sink is usually larger than the size of the second heat sink.

[0031] In some embodiments, there are two feeders 420 and two output reels 430. Each feeder 420 corresponds to one output reel 430. In such embodiments, one output reel 430 carries a second heat sink, while the other output reel 430 carries a third heat sink. The size of the third heat sink differs from that of the second heat sink. However, both output reels 430 may also carry the same heat sink.

[0032] In some embodiments, the heat sink attachment machine 100 further includes a transport device 110. This transport device 110 extends into the first working area 230 and the second working area 240, and can transport several substrates along one direction along the first working area 230 and the second working area 240. In embodiments where the first working area 230 and the second working area 240 are parallel to the direction X, the transport device 110 transports the substrates parallel to the direction X, for example, transporting the substrates from left to right along the direction X in FIG. 2, but is not limited thereto.

[0033] The first substrate module 500 is movable on the platform 200 along directions X, Y, and Z, wherein directions X, Y, and Z are perpendicular to each other. The first substrate module 500 can pick up, transport, and attach a first heat dissipation material or a second heat dissipation material from the first feeding area 210. Specifically, the first substrate module 500 can first move along directions X and Y to the first feeding area 210, then move along direction Z and pick up the first heat dissipation material supplied by the first feeding area 210, then move along directions X and Y and transport the first heat dissipation material from the first feeding area 210 to the first working area 230, and then attach the first heat dissipation material to the substrate of the first working area 230 transported by the transport device 110.

[0034] The second substrate module 600 can also be moved along the X, Y, and Z directions on the platform 200. The second substrate module 600 is separate from the first substrate module 500 and can be symmetrically arranged on the platform 200. The second substrate module 600 can pick up, transport, and attach the first or second heat dissipation material from the second feeding area 220. The second substrate module 600 can first move along the X and Y directions to the second feeding area 220, then move along the Z direction and pick up the second heat dissipation material supplied by the second feeding area 220, and then transport the second heat dissipation material to the second working area 240. The second substrate module 600 then attaches the second heat dissipation material to the substrate of the second working area 240 by the transport device 110.

[0035] Please refer to Figure 3, which shows a top view schematic diagram of the configuration of a heat dissipation material application machine 100a according to the second embodiment of this disclosure. The application machine 100a has a generally similar structure to the application machine 100 of the above embodiment. The difference between the application machine 100a and 100 is that the application machine 100a includes two first feeding modules 300. These two first feeding modules 300 are respectively disposed in the first receiving groove 212 and the second receiving groove 222. At this time, the heat dissipation material disposed in the first feeding area 210 and the second feeding area 220 are both first heat dissipation materials.

[0036] Please refer to Figure 4, which shows a top view of the configuration of a heat dissipation material application machine 100b according to the third embodiment of this disclosure. The application machine 100b has a generally similar structure to the application machine 100 of the above-described embodiment. The difference between the application machine 100b and 100 is that the application machine 100b includes two second feeding modules 400. These two second feeding modules 400 are respectively disposed in the first receiving groove 212 and the second receiving groove 222. In some embodiments, the heat dissipation material supplied in the first feeding area 210 and the second feeding area 220 are both second heat dissipation materials. In other embodiments, since the second feeding module 400 can load various sizes of heat dissipation materials, the first feeding area 210 and the second feeding area 220 can supply heat dissipation materials of different sizes.

[0037] Please refer to Figure 5, which is a flowchart illustrating a method for supplying a heat dissipation material according to one embodiment of the present disclosure. When performing the method for supplying the heat dissipation material, step S100 can be performed first to place the supply module in the supply area. In the embodiment shown in Figure 2, the first supply module 300 and the second supply module 400 are respectively placed in the first receiving groove 212 of the first supply area 210 and the second receiving groove 222 of the second supply area 220 of the platform 200 of the heat dissipation material attachment machine 100. In other embodiments, the first supply module 300 and the second supply module 400 can be interchanged and respectively installed in the second receiving groove 222 and the first receiving groove 212.

[0038] In the embodiment shown in FIG3, step S100 involves placing two first feeding modules 300 in the first receiving groove 212 of the first feeding area 210 and the second receiving groove 222 of the second feeding area 220, respectively. In the embodiment shown in FIG4, step S100 involves placing two second feeding modules 400 in the first receiving groove 212 of the first feeding area 210 and the second receiving groove 222 of the second feeding area 220.

[0039] After the feeding module is set in the feeding area, step S110 can be performed to perform feeding operations using the feeding module. In the embodiment shown in FIG1, step S110 simultaneously uses the first feeding module 300 and the second feeding module 400 to supply the first heat dissipation material to the first substrate module 500 of the heat dissipation material attaching machine 100 and the second heat dissipation material to the second substrate module 600, respectively. Specifically, the first substrate module 500 and the second substrate module 600 move along the X and Y directions respectively above the first feeding module 300 and the second feeding module 400, and then move along the Z direction to pick up the first heat dissipation material and the second heat dissipation material, respectively.

[0040] In an embodiment where the second feeding module 400 includes two feeders 420 and two discharge reel rollers 430, when one of the discharge reel rollers 430 is loaded with a second heat dissipation material and the other discharge reel roller 430 is loaded with a third heat dissipation material, the feeding operation further includes simultaneously supplying the second heat dissipation material and the third heat dissipation material using the second feeding module 400.

[0041] In the embodiment of FIG3, step S110 utilizes two first feeding modules 300 to supply the first heat dissipation material to the first substrate module 500 and the second substrate module 600 of the heat dissipation material attaching machine 100a, respectively. Specifically, the first substrate module 500 and the second substrate module 600 move above the first feeding area 210 and the second feeding area 220, respectively, and respectively pick up the first heat dissipation material supplied by the first feeding modules 300 of the first feeding area 210 and the second feeding area 220 along the Z direction.

[0042] In the embodiment shown in FIG. 4, step S110 involves feeding material using two second feeding modules 400. The first substrate module 500 and the second substrate module 600 move along directions X and Y respectively above the first feeding area 210 and the second feeding area 220, and then respectively pick up the second heat dissipation material supplied by the second feeding modules 400 of the first feeding area 210 and the second feeding area 220 along direction Z. In addition, in some embodiments, the second feeding module 400 can be loaded with heat dissipation materials of different sizes, such as a second heat dissipation material and a third heat dissipation material. Therefore, in such embodiments, the second feeding module 400 can supply both the second heat dissipation material and the third heat dissipation material simultaneously.

[0043] Please refer to Figures 1 and 6, wherein Figure 6 is a flowchart illustrating a method for attaching a heat dissipation material according to one embodiment of the present disclosure. When performing the heat dissipation material attachment method, step S200 can be performed first, where a first feeding module 300 and a second feeding module 400 are used simultaneously to feed materials on the platform 200 of the heat dissipation material attachment machine 100, supplying first and second heat dissipation materials of different sizes respectively.

[0044] After the material feeding operation is completed, step S210 can be performed to use the first implantation module 500 and the second implantation module 600 to perform the material picking operation. Specifically, in the embodiment shown in FIG1, the first implantation module 500 and the second implantation module 600 are moved along the X and Y directions respectively above the first feeding module 300 and the second feeding module 400, and then the first implantation module 500 and the second implantation module 600 are moved along the Z direction to pick up the first heat dissipation material from the first feeding module 300 and the second heat dissipation material from the second feeding module 400, respectively.

[0045] After the pick-up operation is completed, step S220 can be performed to attach the substrates onto the platform 200 of the heat sink attachment machine 100 using the first substrate module 500 and the second substrate module 600. In some embodiments, during the attachment operation, several substrates are first transported to the first working area 230 using the transport device 110. Then, the first substrate module 500 is moved from the first feeding module 300 to the first working area 230, and the first heat sink is attached to these substrates using the first substrate module 500. Next, the substrates are again transported from the first working area 230 to the second working area 240 using the transport device 110. Subsequently, the second substrate module 600 is moved from the second feeding module 400 to the second working area 240, and the second substrate module 600 is attached to these substrates that have already been attached with the first heat sink with the second ... first heat sink with the second heat sink.

[0046] In some embodiments, during the bonding operation, several first substrates and several second substrates to be bonded with heat dissipation material are already present in the first working area 230 and the second working area 240, respectively. In other embodiments, during the bonding operation, the transport device 110 transports these first substrates and second substrates to the first working area 230 and the second working area 240, respectively. During the bonding operation, the first substrate module 500 moves from the first feeding module 300 to the first working area 230 and bonds the absorbed first heat dissipation material to the first substrate in the first working area 230. The second substrate module 600 moves from the second feeding module 400 to the second working area 240 and bonds the absorbed second heat dissipation material to the second substrate in the second working area 240.

[0047] It should be specifically noted that, during the attachment operation described in this embodiment, the actions of the first substrate module 500 attaching the first heat dissipation material to the first substrate and the second substrate module 600 attaching the second heat dissipation material to the second substrate can be performed simultaneously or staggered in time. In other words, the heat dissipation material attachment operations in the first working area 230 and the heat dissipation material attachment operations in the second working area 240 can be performed simultaneously, or they can be staggered in time according to actual needs, such as being required to be completed sequentially due to mechanical or space requirements, but this is not a limitation.

[0048] In an embodiment where the second feeding module 400 simultaneously supplies the second heat dissipation material and the third heat dissipation material, the second substrate mounting module 600 may include a first substrate mounting head 610 and a second substrate mounting head 620. The first substrate mounting head 610 and the second substrate mounting head 620 of the second substrate mounting module 600 respectively pick up the second heat dissipation material and the third heat dissipation material. In this embodiment, the first substrate mounting head 610 and the second substrate mounting head 620 move from the second feeding area 220 to the second working area 240, and can respectively attach the picked-up second heat dissipation material and the third heat dissipation material to the second substrate of the second working area 240.

[0049] As can be seen from the above embodiments, the heat dissipation material application machine disclosed herein can provide material supply and continuous application operations for heat dissipation materials of different sizes to meet the needs of heat dissipation materials of different sizes. During the heat dissipation material application operation, if there is a need for application operations of heat dissipation materials of different sizes, material supply and continuous application operations can be performed simultaneously in the heat dissipation material application machine disclosed herein. Therefore, there is no need to set up another application machine, nor is it necessary to wait for the application operation of the first size of heat dissipation material to be completed before continuing the application operation of the next size of heat dissipation material. Therefore, the operation process can be simplified, and waiting time can be saved.

[0050] Another advantage of this disclosure is that the heat sink application machine disclosed herein can achieve feeding and continuous application of heat sinks of different sizes. Therefore, compared with traditional machines, the number of machines required and the space required for the machines can be reduced.

[0051] Although this disclosure has been disclosed above by way of embodiments, it is not intended to limit this disclosure. Anyone with ordinary knowledge in this art can make various modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0052] A better understanding of the present disclosure can be obtained from the following detailed description in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the features are not drawn to scale. In fact, the dimensions of each feature can be arbitrarily increased or decreased to make the discussion clearer. [Figure 1] is a top view showing the configuration of a heat dissipation material application machine according to a first embodiment of the present disclosure. [Figure 2] is a perspective view showing a heat dissipation material application machine according to a first embodiment of the present disclosure. [Figure 3] is a top view showing the configuration of a heat dissipation material application machine according to a second embodiment of the present disclosure. [Figure 4] is a top view showing the configuration of a heat dissipation material application machine according to a third embodiment of the present disclosure. [Figure 5] is a flowchart showing a heat dissipation material feeding method according to an embodiment of the present disclosure. [Figure 6] is a flowchart showing a heat dissipation material application method according to an embodiment of the present disclosure. [Biomaterial Storage]

[0054] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A heat dissipation material attaching machine, comprising: a platform including a first feeding area and a second feeding area, wherein the first feeding area and the second feeding area respectively have a first receiving groove and a second receiving groove recessed into the platform; at least one first feeding module detachably disposed in the first receiving groove or the second receiving groove, and configured to supply a plurality of first heat dissipation materials; at least one second feeding module detachably disposed in the first receiving groove or the second receiving groove, and configured to supply a plurality of second heat dissipation materials, wherein the at least one first feeding module is different from the at least one second feeding module, and one dimension of the first heat dissipation materials is different from one dimension of the second heat dissipation materials; A first heat transfer module is movable on the platform along an X-axis, a Y-axis, and a Z-axis, wherein the first heat transfer module is configured to pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the first feeding area; and a second heat transfer module is movable on the platform along the X-axis, the Y-axis, and the Z-axis, wherein the second heat transfer module is configured to pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the second feeding area.

2. The heat dissipation material attachment machine as described in claim 1, wherein each of the at least one first feeding module is a tray feeding module, and each of the at least one second feeding module is a feeder feeding module.

3. The heat dissipation material attaching machine as described in claim 2, wherein the tray feeding module comprises: a tray configured to support the first heat dissipation materials; and two support seats respectively disposed on opposite sides of the first receiving groove or opposite sides of the second receiving groove to support and fix the tray; and the feeder feeding module comprises: a transfer module disposed in the first receiving groove or the second receiving groove; at least one feeder disposed on the transfer module; and at least one discharge reel disposed on the at least one feeder.

4. The heat dissipation material attaching machine as described in claim 3, wherein there are two of each of the at least one feeder and the at least one discharge roll roller, and the feeders respectively support the discharge roll rollers.

5. The heat dissipation material attaching machine as described in claim 4, wherein a first of the output reel rollers is configured to load the second heat dissipation materials, a second of the output reel rollers is configured to load a plurality of third heat dissipation materials, one of the third heat dissipation materials having a different size from that of the second heat dissipation materials.

6. The heat dissipation material attaching machine as claimed in claim 1, wherein the platform further includes a first working area and a second working area; the heat dissipation material attaching machine further includes a transport device extending in the first working area and the second working area, and the transport device is configured to transport a plurality of substrates in one direction; and the first substrate module is configured to attach the first heat dissipation material or the second heat dissipation material to the substrates in the first working area, and the second substrate module is configured to attach the first heat dissipation material or the second heat dissipation material to the substrates in the second working area.

7. A heat dissipation material attaching machine, comprising: a platform including a first feeding area and a second feeding area, wherein the first feeding area and the second feeding area respectively have a first receiving groove and a second receiving groove recessed into the platform; at least one first feeding module detachably disposed in the first receiving groove or the second receiving groove, and configured to supply a plurality of first heat dissipation materials; at least one second feeding module detachably disposed in the first receiving groove or the second receiving groove, and configured to supply a plurality of second heat dissipation materials, wherein the at least one first feeding module is the same as or different from the at least one second feeding module, and the first heat dissipation materials are correspondingly the same as or different from one of the dimensions of the second heat dissipation materials; A first heat transfer module is movable on the platform along an X-axis, a Y-axis, and a Z-axis, wherein the first heat transfer module is configured to pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the first feeding area; and a second heat transfer module is movable on the platform along the X-axis, the Y-axis, and the Z-axis, wherein the second heat transfer module is configured to pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the second feeding area.

8. The heat dissipation material attachment machine as described in claim 7, wherein each of the at least one first feeding module is a tray feeding module, and each of the at least one second feeding module is a feeder feeding module.

9. The heat dissipation material attachment machine as described in claim 8, wherein the tray feeding module comprises: a tray configured to support the first heat dissipation materials; and two support seats respectively disposed on opposite sides of the first receiving groove or opposite sides of the second receiving groove to support and fix the tray; and the feeder feeding module comprises: a transfer module disposed in the first receiving groove or the second receiving groove; at least one feeder disposed on the transfer module; and at least one discharge reel disposed on the at least one feeder.

10. A method for supplying heat dissipation material, comprising: setting a first supply module and a second supply module respectively in a first supply area and a second supply area of ​​a platform of a heat dissipation material attaching machine, wherein the first supply module and the second supply module are different; and performing a supply operation to simultaneously supply a plurality of first heat dissipation materials to a first substrate module of the heat dissipation material attaching machine and a plurality of second heat dissipation materials to a second substrate module of the heat dissipation material attaching machine using the first supply module and the second supply module respectively, wherein one dimension of the first heat dissipation materials is different from one dimension of the second heat dissipation materials.

11. The method for supplying heat dissipation material as described in claim 10, wherein the first supply module is a tray supply module and the second supply module is a feeder supply module.

12. The method for feeding heat dissipation material as claimed in claim 11, wherein the feeder module comprises: a transfer module disposed in the platform; two feeders disposed separately on the transfer module; and two discharge reel rollers disposed on the feeders, wherein a first of the discharge reel rollers carries the second heat dissipation material, and a second of the discharge reel rollers carries a plurality of third heat dissipation materials, wherein one of the third heat dissipation materials has a different size than the size of the first heat dissipation material and the size of the second heat dissipation material, wherein performing the feeding operation further comprises simultaneously supplying the third heat dissipation material using the second feeding module.

13. A method for attaching a heat dissipation material, comprising: performing a feeding operation on a platform of a heat dissipation material attaching machine to simultaneously supply a plurality of first heat dissipation materials using a first feeding module and a plurality of second heat dissipation materials using a second feeding module, wherein one dimension of the first heat dissipation materials is different from one dimension of the second heat dissipation materials, and the platform includes a first working area and a second working area; performing a picking operation to pick up the first heat dissipation materials from the first feeding module and the second heat dissipation materials from the second feeding module using a first substrate module and a second substrate module of the heat dissipation material attaching machine; and performing an attaching operation to attach the first heat dissipation materials to the first working area and the second heat dissipation materials to the second working area using the first substrate module and the second substrate module, respectively.

14. The method for attaching a heat dissipation material as described in claim 13, wherein performing the attachment operation further comprises: transporting a plurality of substrates to the first working area using a transport device of the heat dissipation material attachment machine; attaching the first heat dissipation material to the substrates respectively using the first bonding module; transporting the substrates from the first working area to the second working area using the transport device; and attaching the second heat dissipation material to the substrates respectively using the second bonding module.

15. The method for attaching a heat dissipation material as described in claim 13, wherein performing the attachment operation further comprises: transporting a plurality of first substrates and a plurality of second substrates to the first working area and the second working area respectively using a transport device of the heat dissipation material attachment machine; and simultaneously attaching the first heat dissipation material to the first substrates and the second heat dissipation material to the second substrates using the first substrate attachment module and the second substrate attachment module respectively.

16. The method for attaching heat dissipation material as described in claim 13, wherein the first feeding module is a tray feeding module and the second feeding module is a feeder feeding module; the feeder feeding module includes two feeders and two output reel rollers respectively disposed on the feeders, a first of the output reel rollers carries the second heat dissipation material, and a second of the output reel rollers carries a plurality of third heat dissipation materials, one of the third heat dissipation materials having a size different from the size of the first heat dissipation material and the size of the second heat dissipation material; and the attachment operation further includes using a first implantation head and a second implantation head of the second implantation module to pick up the second heat dissipation material and the third heat dissipation material respectively, and using the first implantation head and the second implantation head to attach at least one of the second heat dissipation material and at least one of the third heat dissipation material to each of a plurality of substrates on a second working area.

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