Semiconductor process equipment

Abstract

A semiconductor manufacturing apparatus includes a processing chamber, a base, an atmospheric chamber, and at least one cantilever. Both the base and the atmospheric chamber are disposed within the processing chamber, with the atmospheric chamber positioned below the base. The atmospheric chamber has a first opening and a second opening communicating with its interior. The first opening is connected to the base. At least one cantilever is provided with an atmospheric channel. A first port of the atmospheric channel communicates with the second opening. The sidewall of the processing chamber has a mounting port, through which the second port of the atmospheric channel extends outside the processing chamber. The cantilever with the atmospheric channel is sealed to the inner wall surrounding the mounting port. The cantilever has a top surface, and the side of the top surface facing the bearing surface is provided with a reflective surface. The normal vector of the reflective surface intersects with or is not parallel to the central axis of the bearing surface.

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